Inventor · disambiguated record
Wei-Chun Hsueh
Also filed as: HSUEH WEI-CHUN
1 granted patent·1 pending application·0 citations·filing 2010–2020
5Inventor score
Top patents by PatentIndex Score
2 records- 0142US11996663B2Bonding device, bonding structure for wearable device and node device for forming sensing point on signal connecting line thereofJ MEX INC·Filed 2020·Granted May 28, 2024·0 cites·20 claims
- 0215US2011266321A1Holding device for bicycles accessoriesHSUEH WEI-CHUN·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →