Inventor · disambiguated record

Wen-Sheh Huang

Also filed as: HUANG WEN-SHEH

30 granted patents·8 pending applications·80 citations·filing 2009–2025

95Inventor score

Technology areasH10W H10P H10D G01R

Files withTAIWAN SEMICONDUCTOR MFG CO LTD32 TAIWAN SEMICONDUCTOR MFG2 CHO HSIU-YING1 LIN CHIA-PIN1 TSAI CHUN HSIUNG1

Top patents by PatentIndex Score

38 records

0196US11798848B2Semiconductor device structure with resistive elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 24, 2023·2 cites·20 claims
0295US11942390B2Thermal dissipation in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 26, 2024·2 cites·20 claims
0392US11217482B2Method for forming semiconductor device with resistive elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 4, 2022·5 cites·20 claims
0492US10985011B2Structure and formation method of semiconductor device with resistive elementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 20, 2021·6 cites·20 claims
0592US10304772B2Semiconductor device structure with resistive elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 28, 2019·7 cites·20 claims
0691US8557692B2FinFET LDD and source drain implant techniqueTSAI CHUN HSIUNG·Filed 2010·Granted Oct 15, 2013·15 cites·18 claims
0790US11404369B2Semiconductor device structure with resistive elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 2, 2022·5 cites·20 claims
0890US10515852B2Structure and formation method of semiconductor device with resistive elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·4 cites·20 claims
0988US12347770B2One-time-programmable device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 1, 2025·1 cites·20 claims
1088US11355410B2Thermal dissipation in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 7, 2022·2 cites·20 claims
1187US8034677B2Integrated method for forming high-k metal gate FinFET devicesTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Oct 11, 2011·9 cites·19 claims
1284US2025343095A1Thermal dissipation in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1383US12119262B2Semiconductor device structure with resistive elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
1483US11799001B2Back-end-of-line devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 24, 2023·1 cites·20 claims
1582US12451401B2Thermal dissipation in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 21, 2025·0 cites·20 claims
1682US8187928B2Methods of forming integrated circuitsYu de-wei·Filed 2010·Granted May 29, 2012·8 cites·17 claims
1779US12040178B2Method for manufacturing semiconductor structure with resistive elementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
1878US12068377B2Back-end-of-line devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
1977US8350586B2Method and apparatus of deembeddingTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Jan 8, 2013·9 cites·20 claims
2076US2024371757A1Structure and method of forming a semiconductor device with resistive elementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2176US2024371948A1Back-End-Of-Line DevicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2275US11901289B2Semiconductor device structure with resistive elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
2375US2025329598A1Thermal Sensor Device By Back End Of Line Metal ResistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2475US2024379541A1Nitrogen Plasma Treatment For Improving Interface Between Etch Stop Layer And Copper InterconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2575US2024387365A1One-time-programmable device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2673US12074107B2Structure and method of forming a semiconductor device with resistive elementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·20 claims
2772US12159830B2Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·20 claims
2872US11670501B2Semiconductor device structure with resistive elementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
2970US12417955B2Thermal sensor device by back end of line metal resistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
3067US11437313B2Structure and method of forming a semiconductor device with resistive elementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 6, 2022·0 cites·20 claims
3167US10164002B2Semiconductor device and layout methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·1 cites·20 claims
3266US9147020B2Transmission line characterization using EM calibrationCHO HSIU-YING·Filed 2011·Granted Sep 29, 2015·2 cites·20 claims
3365US12165947B2Semiconductor devices and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·20 claims
3460US8796095B2Integrated method for forming metal gate FinFET devicesLIN CHIA-PIN·Filed 2011·Granted Aug 5, 2014·1 cites·18 claims
3558US11923295B2Interconnect level with high resistance layer and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 5, 2024·0 cites·20 claims
3658US2025218891A1Integrated circuit (ic) structures with thermal path to carrier substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3758US2025191988A1Heat dissipation through seal ringsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
3851US11532548B2Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →