Inventor · disambiguated record

Wei-Po Huang

Also filed as: HUANG WEI-PO

0 granted patents·1 pending application·0 citations·filing 2024–2024

Technology areasH10P

Files withHERAEUS ELECTRONICS GMBH & CO KG1

Top patents by PatentIndex Score

1 record

0151US2025070043A1Method for printing an electrically conductive layer on a surface of 3d electronic assembly and associated 3d electronic assemblyHERAEUS ELECTRONICS GMBH & CO KG·Filed 2024·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →