Inventor · disambiguated record
Wen-Hung Huang
Also filed as: HUANG WEN · HUANG WEN-HUNG
149 granted patents·85 pending applications·594 citations·filing 2002–2025
99Inventor score
Files withADVANCED SEMICONDUCTOR ENG71TAIWAN SEMICONDUCTOR MFG CO LTD39HUANG WEN-HUNG33HANNSPREE INC21NXP BV18
Top patents by PatentIndex Score
234 records- 0199US9236877B2Micro-electro-mechanical systems (MEMS), systems, and operating methods thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 12, 2016·49 cites·20 claims
- 0298US8292018B2Integrated wheel and electric scooter using the wheelHUANG WEN-HUNG·Filed 2011·Granted Oct 23, 2012·66 cites·9 claims
- 0397US11908815B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Feb 20, 2024·2 cites·20 claims
- 0495US11309264B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Apr 19, 2022·3 cites·20 claims
- 0595US10756054B1Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 25, 2020·13 cites·20 claims
- 0695US9016702B2Scooter foldable seat structureLAING BAN INTERNAT INC·Filed 2014·Granted Apr 28, 2015·38 cites·12 claims
- 0794US11894276B2Multiple gate field-effect transistors having various gate oxide thicknesses and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·2 cites·20 claims
- 0894USD710949SScooterLAING BAN INTERNAT INC·Filed 2013·Granted Aug 12, 2014·65 cites·1 claims
- 0993US9379719B1Phase locked loop deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 28, 2016·11 cites·20 claims
- 1091US10903169B2Conductive structure and wiring structure including the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 26, 2021·5 cites·25 claims
- 1191US10277215B2Digital controlled delay lineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·11 cites·20 claims
- 1291US9568990B2System and method for managing power consumption of an information handling systemDELL PRODUCTS LP·Filed 2013·Granted Feb 14, 2017·16 cites·17 claims
- 1390US11515334B2Stacked vertically isolated MOSFET structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·2 cites·20 claims
- 1490US9766288B2On-chip eye diagram captureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 19, 2017·4 cites·19 claims
- 1590US7514765B2Solution of power consumption reduction for inverter covered by metal caseDELL PRODUCTS LP·Filed 2006·Granted Apr 7, 2009·20 cites·5 claims
- 1689US11887943B2Semiconductor devices, semiconductor device packages and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jan 30, 2024·1 cites·16 claims
- 1789US11488901B2Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 1, 2022·2 cites·19 claims
- 1889US7841473B2Electronic device storage/carrying case having a support functionHUANG WEN-HUNG·Filed 2009·Granted Nov 30, 2010·18 cites·14 claims
- 1988US12288770B2Semiconductor packages with embedded wiring on re-distributed bumpsNXP BV·Filed 2022·Granted Apr 29, 2025·2 cites·10 claims
- 2088US11640947B2Pre-resist island forming via method and apparatusNXP BV·Filed 2021·Granted May 2, 2023·2 cites·18 claims
- 2188US11322471B2Semiconductor package structures, semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 3, 2022·5 cites·18 claims
- 2288US9965409B2Data sampling alignment method for memory interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 8, 2018·5 cites·20 claims
- 2388US8629795B2Micro-electro-mechanical systems (MEMS), systems, and operating methods thereofPENG YUNG-CHOW·Filed 2010·Granted Jan 14, 2014·9 cites·20 claims
- 2487US11018120B2Semiconductor device package with stress buffering layer and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 25, 2021·4 cites·17 claims
- 2586US12249585B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2024·Granted Mar 11, 2025·0 cites·20 claims
- 2686US11652673B2Decision feedback equalization embedded in slicerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 16, 2023·1 cites·20 claims
- 2785US10939561B1Wiring structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 2, 2021·3 cites·21 claims
- 2885US9984986B1Semiconductor device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted May 29, 2018·4 cites·28 claims
- 2985US2025343533A1Semiconductor circuit and method for operating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3084US12302627B2Semiconductor device with non-conformal gate dielectric layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 13, 2025·0 cites·20 claims
- 3183US12317574B2Device providing multiple threshold voltages and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 27, 2025·0 cites·20 claims
- 3283US10164758B2Read-write data translation technique of asynchronous clock domainsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·4 cites·19 claims
- 3383US9774245B1PFC switching power conversion circuit providing low total harmonic distortionALITEK TECH CORP·Filed 2016·Granted Sep 26, 2017·9 cites·10 claims
- 3483US7627973B2Frame structure adapted to different display panel thicknesses and corresponding engaging deviceHANNSPREE INC·Filed 2007·Granted Dec 8, 2009·15 cites·11 claims
- 3582US12266575B2Multiple gate field-effect transistors having various gate oxide thicknesses and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 1, 2025·0 cites·20 claims
- 3682US11411082B2Nanowire stack GAA device with selectable numbers of channel stripsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 9, 2022·2 cites·20 claims
- 3782US11211316B1Wiring structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Dec 28, 2021·1 cites·20 claims
- 3882US2025273638A1Semiconductor device package including stress buffering layerADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 3982US2025267920A1Semiconductor device with non-conformal gate dielectric layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4082US2025366165A1Metal gates for multi-gate semiconductor devices and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4181US11271783B2Decision feedback equalization embedded in a slicerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 8, 2022·1 cites·18 claims
- 4281US8179496B2Display casing capable of accommodating LCD panel modules of different sizesLIOU GUAN-DE·Filed 2009·Granted May 15, 2012·9 cites·2 claims
- 4381US2025210552A1Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 4480US12315797B2Semiconductor substrate structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Granted May 27, 2025·0 cites·15 claims
- 4580US12315820B2Wiring structure including low- and high-density conductive structuresADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted May 27, 2025·0 cites·18 claims
- 4680US12300677B2Semiconductor device package including stress buffering layerADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted May 13, 2025·0 cites·13 claims
- 4780US2025287677A1Device providing multiple threshold voltages and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4879US11908745B2Semiconductor device with non-conformal gate dieletric layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 20, 2024·0 cites·20 claims
- 4979US10748935B2Stacked vertically isolated MOSFET structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 18, 2020·2 cites·20 claims
- 5078US7271802B2Dual panel display backlight power controller chip for handheld apparatusRICHTEK TECHNOLOGY CORP·Filed 2004·Granted Sep 18, 2007·18 cites·18 claims
Showing the top 50 of 234 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →