Inventor · disambiguated record
Wei-Jie Huang
Also filed as: HUANG WEI-JIE
12 granted patents·3 pending applications·3 citations·filing 2014–2025
82Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD8CHI MEI CORP4WISTRON NEWEB CORP2TPK ADVANCED SOLUTIONS INC1
Top patents by PatentIndex Score
15 records- 0184US2025364303A1Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0282US9389509B2Photosensitive polysiloxane composition, protecting film and element having the protecting filmCHI MEI CORP·Filed 2015·Granted Jul 12, 2016·2 cites·10 claims
- 0377US12441097B2Lamination process, and manufacturing method of semiconductor package using a chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
- 0475US12391033B2Lamination process, and manufacturing method of semiconductor package using a chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 0573US12500113B2Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·14 claims
- 0672US9851638B2Photosensitive polysiloxane composition and uses thereofCHI MEI CORP·Filed 2016·Granted Dec 26, 2017·1 cites·3 claims
- 0770US11569183B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·20 claims
- 0870US2023115449A1Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 0967US11993066B2Chuck, lamination process, and manufacturing method of semiconductor package using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 28, 2024·0 cites·20 claims
- 1064US12438310B2Electronic device and socket module and metal shielding frame thereofWISTRON NEWEB CORP·Filed 2022·Granted Oct 7, 2025·0 cites·14 claims
- 1160US12147621B1Conductive film and touch sensorTPK ADVANCED SOLUTIONS INC·Filed 2023·Granted Nov 19, 2024·0 cites·20 claims
- 1260US10867939B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 1354US2015031808A1Photosensitive polysiloxane composition and uses thereofCHI MEI CORP·Filed 2014·Application pending·0 cites
- 1452US11528828B2Electronic device with heat-dissipation structureWISTRON NEWEB CORP·Filed 2021·Granted Dec 13, 2022·0 cites·16 claims
- 1539US9507261B2Photosensitive composition, protective film, and element having the protective filmCHI MEI CORP·Filed 2015·Granted Nov 29, 2016·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →