Inventor · disambiguated record
Wei-Ming Hung
Also filed as: HUNG WEI-MING
1 granted patent·3 pending applications·0 citations·filing 2021–2024
3Inventor score
Files withPANJIT INT INC4
Top patents by PatentIndex Score
4 records- 0152US2025239499A1Ultra-thin packaged componentPANJIT INT INC·Filed 2024·Application pending·0 cites
- 0245US12148675B2Power semiconductor package unit of surface mount technology including a plastic film covering a chipPANJIT INT INC·Filed 2021·Granted Nov 19, 2024·0 cites·14 claims
- 0345US2025140573A1Method of manufacturing pre-molded lead frame for packagingPANJIT INT INC·Filed 2023·Application pending·0 cites
- 0443US2023395465A1Semiconductor package with solderable sidewallPANJIT INT INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →