Inventor · disambiguated record
Wee Aun Jason Lim
Also filed as: JASON LIM WEE AUN
0 granted patents·2 pending applications·0 citations·filing 2022–2023
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0151US2023230903A1Semiconductor chip, chip system, method of forming a semiconductor chip, and method of forming a chip systemINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 0241US2023352422A1Semiconductor package and method for marking a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →