Inventor · disambiguated record
Wen-Yi Jian
Also filed as: JIAN WEN-YI
0 granted patents·3 pending applications·0 citations·filing 2024–2024
Technology areasH10W
Files withGLOBAL UNICHIP CORP3
Top patents by PatentIndex Score
3 records- 0158US2025273583A1Interposer device and semiconductor package deviceGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
- 0257US2025105163A1Semiconductor chiplet device and interposerGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
- 0356US2025349695A1Substrate structure and semiconductor packageGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →