Inventor · disambiguated record
Wenfan Jiang
Also filed as: JIANG WENFAN
5 granted patents·2 citations·filing 2012–2020
62Inventor score
Files withUNIV JIANGSU5
Top patents by PatentIndex Score
5 records- 0176US11542571B2Laser shock and supersonic vibration extrusion co-strengthening device and methodUNIV JIANGSU·Filed 2017·Granted Jan 3, 2023·1 cites·9 claims
- 0269US11578384B2Laser shock strengthening method for small-hole components with different thicknessesUNIV JIANGSU·Filed 2017·Granted Feb 14, 2023·1 cites·7 claims
- 0348US11471377B2Switchable vibration modal ultrasonic device and method based on sameUNIV JIANGSU·Filed 2020·Granted Oct 18, 2022·0 cites·18 claims
- 0442US9695866B2Method for manufacturing composite double-metal fracture splitting connecting rodUNIV JIANGSU·Filed 2012·Granted Jul 4, 2017·0 cites·9 claims
- 0532US10899037B2Connecting rod ultrasonic-assisted splitting machining method and machining device thereofUNIV JIANGSU·Filed 2017·Granted Jan 26, 2021·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →