Inventor · disambiguated record
Wei Kong
Also filed as: KONG WEI · KONG WEI-YANG
11 granted patents·13 pending applications·44 citations·filing 1997–2025
86Inventor score
Files withMASSACHUSETTS INST TECHNOLOGY6HENKEL AG & CO KGAA3NANO & ADVANCED MATERIALS INST LTD3YANG CHUNLIN3SUPERPOWER SUPPLY INC2
Top patents by PatentIndex Score
24 records- 0190US9749174B1System and method for dynamic allocation of cloud resourcesAPPCELERATOR INC·Filed 2013·Granted Aug 29, 2017·27 cites·16 claims
- 0288US10517155B2Methods and apparatus for vertically stacked multicolor light-emitting diode (LED) displayMASSACHUSETTS INST TECHNOLOGY·Filed 2018·Granted Dec 24, 2019·6 cites·18 claims
- 0379US7799863B2Low application temperature elastic attachment adhesiveHENKEL AG & CO KGAA·Filed 2005·Granted Sep 21, 2010·4 cites·9 claims
- 0476US7754327B2Absorbent articles comprising a radiation cured hot melt positioning adhesiveHENKEL AG & CO KGAA·Filed 2006·Granted Jul 13, 2010·3 cites·10 claims
- 0573US12469699B2Systems and methods for growth of silicon carbide over a layer comprising graphene and/or hexagonal boron nitride and related articlesMASSACHUSETTS INST TECHNOLOGY·Filed 2023·Granted Nov 11, 2025·0 cites·16 claims
- 0670US11355393B2Atomic precision control of wafer-scale two-dimensional materialsMASSACHUSETTS INST TECHNOLOGY·Filed 2019·Granted Jun 7, 2022·1 cites·12 claims
- 0764US2025277102A1Anti-fogging composition and anti-fogging plastics prepared therefromNANO & ADVANCED MATERIALS INST LTD·Filed 2024·Application pending·0 cites
- 0863US2024417603A1Versatile self-adhesive modifiers on silicone rubber for bonding plastic automaticallyNANO & ADVANCED MATERIALS INST LTD·Filed 2023·Application pending·0 cites
- 0961US2025354017A1Anti-fogging and bacteria-resistant liquid silicone rubber additives and the applications thereofNANO & ADVANCED MATERIALS INST LTD·Filed 2024·Application pending·0 cites
- 1060US2023048760A1Fabrication of single-crystalline ionically conductive materials and related articles and systemsMASSACHUSETTS INST TECHNOLOGY·Filed 2021·Application pending·0 cites
- 1156US12308227B2Epitaxial growth using carbon buffer on substrateMASSACHUSETTS INST TECHNOLOGY·Filed 2019·Granted May 20, 2025·0 cites·15 claims
- 1253US2025223475A1Hot Melt Adhesive Composition for Secured Paper PackagingHENKEL AG & CO KGAA·Filed 2025·Application pending·0 cites
- 1350US12496083B2Attachment assembly, control handle, series motion mechanism, and minimally invasive surgical instrumentWUHAN UNITED IMAGING HEALTHCARE SURGICAL TECH CO LTD·Filed 2021·Granted Dec 16, 2025·0 cites·17 claims
- 1450US2021125826A1Systems and methods for growth of silicon carbide over a layer comprising graphene and/or hexagonal boron nitride and related articlesMASSACHUSETTS INST TECHNOLOGY·Filed 2019·Application pending·0 cites
- 1547US12484904B2Systems, devices and methods of repairing tendons and ligamentsCILAG GMBH INT·Filed 2021·Granted Dec 2, 2025·0 cites·28 claims
- 1647US2009163936A1Coated Tissue Engineering ScaffoldYANG CHUNLIN·Filed 2007·Application pending·0 cites
- 1745US2005176867A1Low application temperature elastic attachment adhesiveFiled 2004·Application pending·0 cites
- 1844US2005244640A1Polymer coating for powder-free elastic strandsRISWICK MARTIN·Filed 2004·Application pending·0 cites
- 1943US2023187355A1Method to Produce Buried Nb Lines Surrounded by TiIBM·Filed 2021·Application pending·0 cites
- 2038US2012021014A1Corrosion current-generating metal particulates and use thereofCHANTALAT JEANNETTE·Filed 2011·Application pending·0 cites
- 2133US2010268335A1Medical devices with galvanic particulatesYANG CHUNLIN·Filed 2010·Application pending·0 cites
- 2229US2010249927A1Medical devices with galvanic particulatesYANG CHUNLIN·Filed 2010·Application pending·0 cites
- 2328USD394854SFront panel for computer caseSUPERPOWER SUPPLY INC·Filed 1997·Granted Jun 2, 1998·2 cites·1 claims
- 2426USD394647SFront panel for computer caseSUPERPOWER SUPPLY INC·Filed 1997·Granted May 26, 1998·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →