Inventor · disambiguated record
Werner Kroeninger
Also filed as: KROENINGER WERNER
11 granted patents·1 pending application·106 citations·filing 2007–2011
89Inventor score
Top patents by PatentIndex Score
12 records- 0195US7759163B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jul 20, 2010·49 cites·17 claims
- 0288US7582513B2Electronic device and method for producing electronic devicesINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 1, 2009·20 cites·16 claims
- 0383US7923350B2Method of manufacturing a semiconductor device including etching to etch stop regionsINFINEON TECHNOLOGIES AG·Filed 2008·Granted Apr 12, 2011·8 cites·11 claims
- 0482US8003292B2Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layerINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 23, 2011·4 cites·15 claims
- 0581US7863104B2Method of producing a thin semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jan 4, 2011·8 cites·22 claims
- 0678US7674654B2Producing thin integrated semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 9, 2010·8 cites·19 claims
- 0772US7824962B2Method of integrated circuit fabricationINFINEON TECHNOLOGIES AG·Filed 2008·Granted Nov 2, 2010·4 cites·23 claims
- 0871US8017942B2Semiconductor device and methodINFINEON TECHNOLOGIES AG·Filed 2008·Granted Sep 13, 2011·4 cites·14 claims
- 0963US7918714B2Methods for treating wafers on assembly carriersINFINEON TECHNOLOGIES AG·Filed 2007·Granted Apr 5, 2011·1 cites·25 claims
- 1054US8415080B2Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layerKROENINGER WERNER·Filed 2011·Granted Apr 9, 2013·0 cites·6 claims
- 1147US8753176B2Device for treating wafers on assembly carriersKROENINGER WERNER·Filed 2011·Granted Jun 17, 2014·0 cites·19 claims
- 1242US2008014715A1Device and method for the processing of wafersINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →