Inventor · disambiguated record
Wen-Chang Kuo
Also filed as: KUO WEN-CHANG
32 granted patents·24 pending applications·157 citations·filing 1999–2025
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD39TAIWAN SEMICONDUCTOR MFG12HUANG CHIEN C1IND TECH RES INST1KENSTONE METAL CO LTD1
Top patents by PatentIndex Score
56 records- 0194US11901387B2Image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·2 cites·20 claims
- 0289US9812569B2Semiconductor device and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 7, 2017·6 cites·4 claims
- 0388US12062679B2Backside structure for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 13, 2024·1 cites·20 claims
- 0488US11908878B2Image sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·1 cites·20 claims
- 0588US10090392B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 2, 2018·9 cites·19 claims
- 0688US2025338658A1Stacked structure for cmos image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0788US2025338660A1Backside structure for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0887US10163831B2Semiconductor device with post passivation structure and fabrication method thereforTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·4 cites·20 claims
- 0987US6712260B1Bump reflow method by inert gas plasmaTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Mar 30, 2004·39 cites·61 claims
- 1087US2025338659A1Csi with controllable isolation structure and methods of manufacturing and using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1186US9728637B2Mechanism for forming semiconductor device with gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 8, 2017·4 cites·20 claims
- 1285US12490538B2Stacked structure for CMOS image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 1383US12381166B2Method of making semiconductor structure including buffer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·20 claims
- 1483US2025338644A1Backside deep trench isolation (bdti) structure for cmos image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1583US2024395843A1Image sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1682US9281215B2Mechanism for forming gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 8, 2016·5 cites·13 claims
- 1782US2024363664A1Backside structure for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1882US2024379710A1Csi with controllable isolation structure and methods of manufacturing and using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1980US10680103B2Method of forming semiconductor device with gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 9, 2020·2 cites·20 claims
- 2080US6620722B2Bumping processTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Sep 16, 2003·28 cites·23 claims
- 2180US2025318304A1Isolation structure with multiple components to increase image sensor performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2279US2023395631A1Image sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2378US12389625B2Semiconductor device with gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
- 2478US2025351605A1Image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2576US11810879B2Semiconductor structure including buffer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·20 claims
- 2676US11494497B2System and device for data protection and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 8, 2022·2 cites·20 claims
- 2776US2025323194A1Bond structure for stacked ic chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2875US12373581B2System and device for data protection and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 2975US6598314B1Method of drying wafersTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jul 29, 2003·20 cites·24 claims
- 3074US12218166B2CSI with controllable isolation structure and methods of manufacturing and using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 4, 2025·0 cites·20 claims
- 3174US2025246565A1Bond structure for stacked ic chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3273US12176370B2Stacked structure for CMOS image sensors including through-substrate-via contacting negative bias circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 24, 2024·0 cites·20 claims
- 3371US11309268B2Method of designing a layout, method of making a semiconductor structure and semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·0 cites·20 claims
- 3470US2023361149A1Backside deep trench isolation (bdti) structure for cmos image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3569US11600727B2Method of forming semiconductor device with gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 7, 2023·0 cites·20 claims
- 3669US9865731B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 9, 2018·2 cites·20 claims
- 3769US7906425B2Fluxless bumping processTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Mar 15, 2011·4 cites·10 claims
- 3868US12001571B2System and device for data protection and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 3967US7134199B2Fluxless bumping processTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 14, 2006·10 cites·13 claims
- 4062US7133735B2Experiment management system and method thereof in semiconductor manufacturing environmentTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Nov 7, 2006·3 cites·23 claims
- 4161US2024186356A1Image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4260US10727191B2Semiconductor device with post passivation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 28, 2020·0 cites·20 claims
- 4358US2009157455A1Instruction system and method for equipment problem solvingTAIWAN SEMICONDUCTOR MFG·Filed 2008·Application pending·0 cites
- 4458US2025294905A1Image sensors and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4557US2005055259A1Instruction system and method for equipment problem solvingFiled 2003·Application pending·0 cites
- 4656US10516048B2Fabrication of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 24, 2019·0 cites·20 claims
- 4756US7647132B2Method and system for problem case packagingTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jan 12, 2010·0 cites·18 claims
- 4853US2024088187A1Deep trench isolation structure for high resolution cis pixelTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4949US6691738B2Filler for airtight containerTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Feb 17, 2004·6 cites·19 claims
- 5047US2021388865A1Composite Crank and Method for Manufacturing the SameKENSTONE METAL CO LTD·Filed 2021·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →