Inventor · disambiguated record
Wen-Chieh Lai
Also filed as: LAI WEN-CHIEH
1 granted patent·2 pending applications·1 citations·filing 2013–2022
15Inventor score
Top patents by PatentIndex Score
3 records- 0159US2023192501A1Silicon-based powders and method for producing the sameFORMOSA PLASTICS CORP·Filed 2022·Application pending·0 cites
- 0254US2023192541A1Fiber composite material and method for producing the sameFORMOSA PLASTICS CORP·Filed 2022·Application pending·0 cites
- 0347US8861687B2Integrated hybird circuit applied to a digital subscriber loop and setting method thereofREALTEK SEMICONDUCTOR CORP·Filed 2013·Granted Oct 14, 2014·1 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →