Inventor · disambiguated record

Wei-An Lai

Also filed as: LAI WEI-AN

38 granted patents·16 pending applications·23 citations·filing 2014–2025

95Inventor score

Technology areasH10W H10D G06F G11C

Files withTAIWAN SEMICONDUCTOR MFG CO LTD52 MACRONIX INT CO LTD1 TIAWAN SEMICONDUCTOR MFG CO LTD1

Top patents by PatentIndex Score

54 records

0196US11355487B2Layout designs of integrated circuits having backside routing tracksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 7, 2022·3 cites·20 claims
0292US11658119B2Backside signal interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·2 cites·20 claims
0390US10878158B2Semiconductor device including cell region having more similar cell densities in different height rows, and method and system for generating layout diagram of sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·3 cites·20 claims
0488US11756876B2Semiconductor devices having power rails and signal tracks arranged in different layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 12, 2023·2 cites·20 claims
0588US11133254B2Hybrid power rail structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 28, 2021·5 cites·20 claims
0688US2025364409A1Methods for generating a circuit with high density routing layoutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0788US2024364811A1Semiconductor device having more similar cell densities in alternating rows, and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
0888US2025357185A1Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0987US2025359341A1Backside conducting lines in integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1086US11409937B2Semiconductor device including cell region having more similar cell densities in different height rows, and method and system for generating layout diagram of sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·1 cites·20 claims
1185US12086524B2Semiconductor device having more similar cell densities in alternating rowsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
1285US11769723B2Three dimensional integrated circuit with monolithic inter-tier vias (MIV)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 26, 2023·1 cites·20 claims
1384US12288785B2Layout designs of integrated circuits having backside routing tracksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 29, 2025·0 cites·20 claims
1484US11018157B2Local interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 25, 2021·3 cites·19 claims
1584US2025329641A1Deep lines and shallow lines in signal conducting pathsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1684US2025391764A1Three dimensional integrated circuit with monolithic inter-tier vias (miv)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1783US11737254B2Memory device and layout, manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 22, 2023·1 cites·20 claims
1883US2025255004A1Layout designs of integrated circuits having backside routing tracksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1982US10797078B2Hybrid fin field-effect transistor cell structures and related methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 6, 2020·2 cites·20 claims
2081US12456678B2Methods for generating a circuit with high density routing layoutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 28, 2025·0 cites·15 claims
2181US12388013B2Three dimensional integrated circuit with monolithic inter-tier vias (MIV)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
2280US12388016B2Deep lines and shallow lines in signal conducting pathsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
2380US11797746B2Method of forming semiconductor device having more similar cell densities in alternating rowsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
2480US2025359326A1Integrated circuit, system and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2579US12230572B2Backside signal interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
2679US12101922B2Memory device and layout, manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·20 claims
2779US2024373616A1Transistor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2878US12463089B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 4, 2025·0 cites·20 claims
2977US11908852B2Layout designs of integrated circuits having backside routing tracksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
3077US2024266345A1Backside conducting lines in integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3176US2024395891A1Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3275US12218050B2Manufacturing method for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
3374US2025253242A1Backside signal interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3472US11721576B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·17 claims
3571US12307183B2Variable width nano-sheet field-effect transistor cell structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 20, 2025·0 cites·19 claims
3671US11854786B2Deep lines and shallow lines in signal conducting pathsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
3771US11569166B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·20 claims
3871US2023395503A1Method of making integrated circuit with backside interconnectionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
3971US2023402461A1Integrated circuit, system and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
4070US12464771B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 4, 2025·0 cites·24 claims
4170US2023335485A1Semiconductor device including power meshTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
4269US11942469B2Backside conducting lines in integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 26, 2024·0 cites·20 claims
4369US11923297B2Apparatus and methods for generating a circuit with high density routing layoutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
4468US12218141B2Hybrid fin field-effect transistor cell structures and related methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 4, 2025·0 cites·20 claims
4568US11916077B2Method for routing local interconnect structure at same level as reference metal lineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·0 cites·20 claims
4667US11990477B2Hybrid fin field-effect transistor cell structures and related methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 21, 2024·0 cites·20 claims
4766US12218057B2Integrated circuit with backside interconnections and method of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 4, 2025·0 cites·20 claims
4863US12068305B2Multiple fin height integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 20, 2024·0 cites·20 claims
4962US11429774B1Variable width nano-sheet field-effect transistor cell structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 30, 2022·0 cites·20 claims
5061US2024194682A1Local interconnect structureTIAWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites

Showing the top 50 of 54 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →