Inventor · disambiguated record
Weisheng Lei
Also filed as: LEI WEISHENG
9 granted patents·4 pending applications·153 citations·filing 2004–2010
88Inventor score
Top patents by PatentIndex Score
13 records- 0194US8710402B2Method of and apparatus for laser drilling holes with improved taperLEI WEISHENG·Filed 2007·Granted Apr 29, 2014·33 cites·20 claims
- 0293US7605343B2Micromachining with short-pulsed, solid-state UV laserELECTRO SCIENT IND INC·Filed 2006·Granted Oct 20, 2009·25 cites·32 claims
- 0387US8116341B2Multiple laser wavelength and pulse width process drillingLEI WEISHENG·Filed 2007·Granted Feb 14, 2012·13 cites·11 claims
- 0487US7259354B2Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectoriesELECTRO SCIENT IND INC·Filed 2004·Granted Aug 21, 2007·40 cites·27 claims
- 0585US9346130B2Method for laser processing glass with a chamfered edgeLEI WEISHENG·Filed 2008·Granted May 24, 2016·12 cites·45 claims
- 0676US8415586B2Method for increasing throughput of solder mask removal by minimizing the number of cleaning pulsesLEI WEISHENG·Filed 2009·Granted Apr 9, 2013·4 cites·22 claims
- 0776US7057133B2Methods of drilling through-holes in homogenous and non-homogenous substratesELECTRO SCIENT IND INC·Filed 2004·Granted Jun 6, 2006·26 cites·14 claims
- 0853US2010078418A1Method of laser micro-machining stainless steel with high cosmetic qualityELECTRO SCIENT IND INC·Filed 2009·Application pending·0 cites
- 0952US7982161B2Method and apparatus for laser drilling holes with tailored laser pulsesELECTRO SCIENT IND INC·Filed 2008·Granted Jul 19, 2011·0 cites·20 claims
- 1051US2010078416A1Method of laser micro-machining stainless steel with high cosmetic qualityELECTRO SCIENT IND·Filed 2008·Application pending·0 cites
- 1149US2010252959A1Method for improved brittle materials processingELECTRO SCIENT IND INC·Filed 2010·Application pending·0 cites
- 1248US2010252540A1Method and apparatus for brittle materials processingELECTRO SCIENT IND INC·Filed 2010·Application pending·0 cites
- 1339US7985942B2Method of providing consistent quality of target material removal by lasers having different output performance characteristicsELECTRO SCIENT IND INC·Filed 2005·Granted Jul 26, 2011·0 cites·6 claims
Join the waitlist — get patent alerts
Get an alert when Weisheng Lei files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →