Inventor · disambiguated record
Wensen Li
Also filed as: LI WENSEN
2 granted patents·4 citations·filing 2000–2002
50Inventor score
Files withHEADWAY TECHNOLOGIES INC2
Top patents by PatentIndex Score
2 records- 0150US6767477B2Etching process to selectively remove copper plating seed layerHEADWAY TECHNOLOGIES INC·Filed 2002·Granted Jul 27, 2004·2 cites·12 claims
- 0245US6428719B1Etching process to selectively remove copper plating seed layerHEADWAY TECHNOLOGIES INC·Filed 2000·Granted Aug 6, 2002·2 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →