Inventor · disambiguated record
Weiping Li
Also filed as: LI WEIPING
73 granted patents·27 pending applications·1,390 citations·filing 1993–2025
99Inventor score
Files withYIBU SEMICONDUCTOR CO LTD23APPLE INC18SHENZHEN LANHE TECH CO LTD10COMPETITIVE TECHNOLOGIES OF PA8HWANG CHERNG-DAW4
Top patents by PatentIndex Score
100 records- 0198US11549799B2Self-mixing interference device for sensing applicationsAPPLE INC·Filed 2020·Granted Jan 10, 2023·8 cites·21 claims
- 0298US6899731B2Controlled delivery of therapeutic agents by insertable medical devicesBOSTON SCIENT SCIMED INC·Filed 2001·Granted May 31, 2005·281 cites·57 claims
- 0397US11319960B2Portable temperature regulation deviceSHENZHEN LANHE TECH CO LTD·Filed 2021·Granted May 3, 2022·13 cites·20 claims
- 0497US11187241B1Portable blowing deviceSHENZHEN LANHE TECH CO LTD·Filed 2021·Granted Nov 30, 2021·25 cites·20 claims
- 0597US10072815B2Top-emission VCSEL-array with integrated diffuserAPPLE INC·Filed 2016·Granted Sep 11, 2018·17 cites·20 claims
- 0696US11873825B2Portable blowing deviceSHENZHEN LANHE TECH CO LTD·Filed 2023·Granted Jan 16, 2024·6 cites·19 claims
- 0796US11624370B2Portable blowing deviceSHENZHEN LANHE TECH CO LTD·Filed 2022·Granted Apr 11, 2023·5 cites·16 claims
- 0896US10153614B1Creating arbitrary patterns on a 2-D uniform grid VCSEL arrayAPPLE INC·Filed 2017·Granted Dec 11, 2018·9 cites·12 claims
- 0996US6275531B1Scalable video coding method and apparatusOPTIVISION INC·Filed 1998·Granted Aug 14, 2001·274 cites·11 claims
- 1095US12125776B2Method for forming semiconductor package and semiconductor packageYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted Oct 22, 2024·2 cites·14 claims
- 1195US10295145B2Top-emission VCSEL-array with integrated diffuserAPPLE INC·Filed 2018·Granted May 21, 2019·9 cites·13 claims
- 1295US9735539B2VCSEL structure with embedded heat sinkAPPLE INC·Filed 2016·Granted Aug 15, 2017·8 cites·18 claims
- 1395US2025391816A1Method of Forming Stacked Chip Packages Using Chip CouplersYIBU SEMICONDUCTOR CO LTD·Filed 2025·Application pending·0 cites
- 1494US12218090B2Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assemblyYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted Feb 4, 2025·2 cites·18 claims
- 1594US12060893B2Portable blowing deviceSHENZHEN LANHE TECH CO LTD·Filed 2021·Granted Aug 13, 2024·4 cites·9 claims
- 1694US7830409B2Split screen video in a multimedia communication systemHWANG CHERNG-DAW·Filed 2005·Granted Nov 9, 2010·47 cites·36 claims
- 1793US10454241B2VCSEL structure with embedded heat sinkAPPLE INC·Filed 2018·Granted Oct 22, 2019·5 cites·20 claims
- 1893US10103512B2VCSEL structure with embedded heat sinkAPPLE INC·Filed 2017·Granted Oct 16, 2018·5 cites·12 claims
- 1993US9819144B2High-efficiency vertical emitters with improved heat sinkingAPPLE INC·Filed 2016·Granted Nov 14, 2017·9 cites·13 claims
- 2091US9673226B2Thin film transistor array substrate, display panel and display deviceXIAMEN TIANMA MICRO ELECTRONICS CO LTD·Filed 2015·Granted Jun 6, 2017·4 cites·4 claims
- 2191US8262250B2Modular LED lighting systems and flexible or rigid strip lighting devicesLI QING CHARLES·Filed 2009·Granted Sep 11, 2012·101 cites·24 claims
- 2290US7232805B2Cobalamin conjugates for anti-tumor therapyINFLABLOC PHARMACEUTICALS INC·Filed 2003·Granted Jun 19, 2007·61 cites·21 claims
- 2388US12159850B2Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assemblyYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted Dec 3, 2024·1 cites·20 claims
- 2488USD1049355SNeck air conditionerSHENZHEN LANHE TECH CO LTD·Filed 2022·Granted Oct 29, 2024·13 cites·1 claims
- 2588US10705347B2Wafer-level high aspect ratio beam shapingAPPLE INC·Filed 2019·Granted Jul 7, 2020·6 cites·20 claims
- 2688US5453945AMethod for decomposing signals into efficient time-frequency representations for data compression and recognitionFiled 1994·Granted Sep 26, 1995·123 cites·27 claims
- 2787US12154884B2Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assemblyYIBU SEMICONDUCTOR CO LTD·Filed 2022·Granted Nov 26, 2024·1 cites·20 claims
- 2886US12362327B2Method of forming packages of stacked chipsYIBU SEMICONDUCTOR CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 2986US11819610B2Visual laryngeal maskZHEJIANG UE MEDICAL CORP·Filed 2022·Granted Nov 21, 2023·2 cites·9 claims
- 3084US12270736B1DGT passive sampling device and method for water body detectionINNER MONGOLIA UNIV OF SCIENCE AND TECHNOLOGY·Filed 2024·Granted Apr 8, 2025·4 cites·14 claims
- 3184US6931060B1Video processing of a quantized base layer and one or more enhancement layersOPTIVISION INC·Filed 2000·Granted Aug 16, 2005·24 cites·23 claims
- 3281USD986540SShoeXIAMEN DOWIMART TRADING CO LTD·Filed 2022·Granted May 23, 2023·9 cites·1 claims
- 3380US11322630B2Monolithic infrared transceiverAPPLE INC·Filed 2020·Granted May 3, 2022·1 cites·17 claims
- 3480US10411437B2Creating arbitrary patterns on a 2-D uniform grid VCSEL arrayAPPLE INC·Filed 2018·Granted Sep 10, 2019·1 cites·8 claims
- 3578US10700493B2Creating arbitrary patterns on a 2-D uniform grid VCSEL arrayAPPLE INC·Filed 2019·Granted Jun 30, 2020·1 cites·18 claims
- 3677US12345529B2Self-mixing interference device for sensing applicationsAPPLE INC·Filed 2023·Granted Jul 1, 2025·0 cites·19 claims
- 3777USD1041743SElectronic atomizing deviceSHENZHEN JINGLIANG LONGQING NETWORK TECH CO LTD·Filed 2024·Granted Sep 10, 2024·8 cites·1 claims
- 3877US5592569AMethod for encoding and decoding imagesCOMPETITIVE TECH INC·Filed 1995·Granted Jan 7, 1997·46 cites·8 claims
- 3977US2025118649A1Method for Forming Semiconductor Package and Semiconductor PackageYIBU SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 4076US12406964B2Chip package and method of forming chip packagesYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted Sep 2, 2025·0 cites·21 claims
- 4176US12087737B2Method of forming chip package having stacked chipsYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted Sep 10, 2024·0 cites·20 claims
- 4276US11973061B2Chip package including stacked chips and chip couplersYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted Apr 30, 2024·0 cites·20 claims
- 4376US6473528B2Shape adaptive technique for image and video compressionCOMPETITIVE TECHNOLOGIES OF PA·Filed 2001·Granted Oct 29, 2002·11 cites·2 claims
- 4474US6580834B2Method and apparatus for encoding and decoding signalsCOMPETITIVE TECHNOLOGIES OF PA·Filed 1997·Granted Jun 17, 2003·48 cites·26 claims
- 4573US5436985AApparatus and method for encoding and decoding imagesCOMPETITIVE TECH INC·Filed 1993·Granted Jul 25, 1995·28 cites·15 claims
- 4672US12293986B2Method for forming chip packages and a chip packageYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted May 6, 2025·0 cites·17 claims
- 4772US12224267B2Chip interconnecting method, interconnect device and method for forming chip packagesYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted Feb 11, 2025·0 cites·19 claims
- 4872US12152595B2Portable blowing deviceSHENZHEN LANHE TECH CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·12 claims
- 4971US12087734B2Method for forming chip packages and a chip package having a chipset comprising a first chip and a second chipYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted Sep 10, 2024·0 cites·17 claims
- 5070US10951008B2Creating arbitrary patterns on a 2-d uniform grid VCSEL arrayAPPLE INC·Filed 2020·Granted Mar 16, 2021·0 cites·16 claims
Showing the top 50 of 100 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Weiping Li files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →