Inventor · disambiguated record

Wei-Wei Liang

Also filed as: Liang wei-wei

6 granted patents·3 pending applications·0 citations·filing 2018–2024

65Inventor score

Technology areasH10P

Files withTAIWAN SEMICONDUCTOR MFG CO LTD9

Top patents by PatentIndex Score

9 records

0176US12002684B2Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
0276US2024290629A1Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
0374US2024363404A1Ion implant process for defect elimination in metal layer planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
0467US11508585B2Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
0566US2022359277A1Ion implant process for defect elimination in metal layer planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
0657US11658065B2Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 23, 2023·0 cites·20 claims
0756US12297375B2Slurry composition and method for polishing and integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 13, 2025·0 cites·20 claims
0855US11450565B2Ion implant process for defect elimination in metal layer planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·20 claims
0944US10858544B2Chemical mechanical polishing slurry and chemical mechanical polishing process using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·0 cites·7 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →