Inventor · disambiguated record
Wen-Feng Liao
Also filed as: LIAO WEN-FENG
3 granted patents·4 citations·filing 2015–2023
56Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3
Top patents by PatentIndex Score
3 records- 0182US9535091B2Probe head, probe card assembly using the same, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 3, 2017·3 cites·20 claims
- 0281US11604211B1Testing device and method for integrated circuit packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 14, 2023·1 cites·20 claims
- 0369US11994534B2Testing device for integrated circuit packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 28, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →