Inventor · disambiguated record

Wei-Hsun Liao

Also filed as: LIAO WEI · LIAO WEI-HSUN

1 granted patent·1 pending application·0 citations·filing 2023–2023

2Inventor score

Technology areasH04L H10W

Files withAT & T IP I LP1 GLOBAL UNICHIP CORP1

Top patents by PatentIndex Score

2 records

0153US2025141714A1Network-to-network interconnection transferAT & T IP I LP·Filed 2023·Application pending·0 cites
0249US12506057B2Interposer device and semiconductor package structureGLOBAL UNICHIP CORP·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →