Inventor · disambiguated record
Wee Aun Jason Lim
Also filed as: LIM WEE AUN JASON
2 granted patents·0 citations·filing 2020–2020
23Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG2
Top patents by PatentIndex Score
2 records- 0147US11211356B2Power semiconductor package and method for fabricating a power semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Dec 28, 2021·0 cites·17 claims
- 0242US11239127B2Topside-cooled semiconductor package with molded standoffINFINEON TECHNOLOGIES AG·Filed 2020·Granted Feb 1, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →