Inventor · disambiguated record
Wei Lee Lim
Also filed as: LIM WEI LEE
1 granted patent·1 pending application·0 citations·filing 2019–2020
6Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG2
Top patents by PatentIndex Score
2 records- 0136US2020043876A1Adhesion Enhancing Structures for a PackageINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 0232US11817418B2Semiconductor device comprising a can housing a semiconductor die which is embedded by an encapsulantINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 14, 2023·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →