Inventor · disambiguated record
Wenxiong Lin
Also filed as: LIN WENXIONG
3 granted patents·2 pending applications·1 citations·filing 2016–2021
46Inventor score
Files withFUJIAN INSTITUTE OF RES ON THE STRUCTURE OF MATTER CHINESE ACADEMY OF SCIENCE3FUJIAN CAS CERAMIC OPTOELECTRONICS TECH CO LTD2
Top patents by PatentIndex Score
5 records- 0154US11123920B23D printing apparatus and methodFUJIAN INSTITUTE OF RES ON THE STRUCTURE OF MATTER CHINESE ACADEMY OF SCIENCE·Filed 2016·Granted Sep 21, 2021·1 cites·11 claims
- 0251US2021291451A1Semi-permeable element, use thereof and preparation method therefor and 3d printing deviceFUJIAN INSTITUTE OF RES ON THE STRUCTURE OF MATTER CHINESE ACADEMY OF SCIENCE·Filed 2021·Application pending·0 cites
- 0342US2019016051A1Semi-permeable element, use thereof and preparation method therefor and 3d printing deviceFUJIAN INSTITUTE OF RES ON THE STRUCTURE OF MATTER CHINESE ACADEMY OF SCIENCE·Filed 2016·Application pending·0 cites
- 0434US10600766B2Dual-channel heat-conducting encapsulation structure and encapsulation method of a solid-state phosphor integrated light sourceFUJIAN CAS CERAMIC OPTOELECTRONICS TECH CO LTD·Filed 2016·Granted Mar 24, 2020·0 cites·15 claims
- 0526US10504875B2Die-bonding substrate, high-density integrated COB white light source and method for manufacturing the sameFUJIAN CAS CERAMIC OPTOELECTRONICS TECH CO LTD·Filed 2016·Granted Dec 10, 2019·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →