Inventor · disambiguated record
Wei-Feng Lin
Also filed as: LIN WEI · LIN WEI-FENG
75 granted patents·15 pending applications·657 citations·filing 1994–2024
99Inventor score
Files withOMNIVISION TECH INC50SILICON INTEGRATED SYS CORP23LIN WEI-FENG4POWERCHIP SEMICONDUCTOR CORP2CHIEN YEH-AN1
Top patents by PatentIndex Score
90 records- 0195US6395996B1Multi-layered substrate with a built-in capacitor designSILICON INTEGRATED SYS CORP·Filed 2000·Granted May 28, 2002·104 cites·1 claims
- 0294US12064090B2Endoscope tip assembly using cavity interposer to allow coplanar camera and LEDsOMNIVISION TECH INC·Filed 2021·Granted Aug 20, 2024·3 cites·18 claims
- 0393US9935144B1System-in-package image sensorOMNIVISION TECH INC·Filed 2016·Granted Apr 3, 2018·10 cites·8 claims
- 0493US9748293B1Image sensor packages with folded cover-glass sealing interfaceOMNIVISION TECH INC·Filed 2016·Granted Aug 29, 2017·11 cites·13 claims
- 0592US9349763B1Curved image sensor systems and methods for manufacturing the sameOMNIVISION TECH INC·Filed 2015·Granted May 24, 2016·8 cites·17 claims
- 0691US9406716B2Infrared reflection/absorption layer for reducing ghost image of infrared reflection noise and image sensor using the sameOMNIVISION TECH INC·Filed 2015·Granted Aug 2, 2016·8 cites·12 claims
- 0790US10312276B2Image sensor package to limit package height and reduce edge flareOMNIVISION TECH INC·Filed 2017·Granted Jun 4, 2019·7 cites·16 claims
- 0889US9184200B2Infrared reflection/absorption layer for reducing ghost image of infrared reflection noise and image sensor using the sameOMNIVISION TECH INC·Filed 2015·Granted Nov 10, 2015·6 cites·13 claims
- 0988US11172806B2Medical micro-cable structure and connection method with mini camera cube chipOMNIVISION TECH INC·Filed 2020·Granted Nov 16, 2021·3 cites·30 claims
- 1088US9111832B2Infrared reflection/absorption layer for reducing ghost image of infrared reflection noise and image sensor using the sameOMNIVISION TECH INC·Filed 2012·Granted Aug 18, 2015·8 cites·21 claims
- 1187US7209354B2Ball grid array package with heat sink deviceSILICON INTERGRATED SYSTEMS CO·Filed 2003·Granted Apr 24, 2007·47 cites·16 claims
- 1286US10243014B2System-in-package image sensorOMNIVISION TECH INC·Filed 2018·Granted Mar 26, 2019·4 cites·5 claims
- 1385US9653504B1Chip-scale packaged image sensor packages with black masking and associated packaging methodsOMNIVISION TECH INC·Filed 2015·Granted May 16, 2017·5 cites·11 claims
- 1485US8269300B2Apparatus and method for using spacer paste to package an image sensorCHIEN YEH-AN·Filed 2008·Granted Sep 18, 2012·22 cites·10 claims
- 1585US6747350B1Flip chip package structureSILICON INTEGRATED SYS CORP·Filed 2003·Granted Jun 8, 2004·51 cites·10 claims
- 1682US9450004B2Wafer-level encapsulated semiconductor device, and method for fabricating sameOMNIVISION TECH INC·Filed 2014·Granted Sep 20, 2016·8 cites·15 claims
- 1782US6116427ATray for ball grid array devicesSILICON INTEGRATED SYS CORP·Filed 2000·Granted Sep 12, 2000·30 cites·7 claims
- 1881US5497258ASpatial light modulator including a VLSI chip and using solder for horizontal and vertical component positioningUNIV COLORADO·Filed 1994·Granted Mar 5, 1996·76 cites·38 claims
- 1978US8896743B2Enclosure for image capture systems with focusing capabilitiesDU ZHENG·Filed 2011·Granted Nov 25, 2014·6 cites·18 claims
- 2077US11973098B2Dam of image sensor module having sawtooth pattern and inclined surface on its inner wall and method of making sameOMNIVISION TECH INC·Filed 2022·Granted Apr 30, 2024·0 cites·15 claims
- 2177US10204947B2Cover-glass-free array camera with individually light-shielded camerasOMNIVISION TECH INC·Filed 2016·Granted Feb 12, 2019·2 cites·8 claims
- 2276US10998361B2Image-sensor package and associated methodOMNIVISION TECH INC·Filed 2018·Granted May 4, 2021·2 cites·14 claims
- 2376US6670692B1Semiconductor chip with partially embedded decoupling capacitorsSILICON INTEGRATED SYS CORP·Filed 2002·Granted Dec 30, 2003·31 cites·16 claims
- 2475US10152291B2Multi-projector display box for use in retail marketingOMNIVISION TECH INC·Filed 2015·Granted Dec 11, 2018·2 cites·24 claims
- 2575US6057596AChip carrier having a specific power join distribution structureSILICON INTEGRATED SYS CORP·Filed 1998·Granted May 2, 2000·46 cites·19 claims
- 2675US2024355846A1Apparatus and method for curved-surface image sensorOMNIVISION TECH INC·Filed 2024·Application pending·0 cites
- 2774US9459500B2Liquid crystal on silicon panels and associated methodsOMNIVISION TECH INC·Filed 2015·Granted Oct 4, 2016·1 cites·19 claims
- 2873US9812478B2Aerogel-encapsulated image sensor and manufacturing method for sameOMNIVISION TECH INC·Filed 2015·Granted Nov 7, 2017·2 cites·10 claims
- 2973US6524942B2Bond pad structure and its method of fabricatingSILICON INTEGRATED SYS CORP·Filed 2002·Granted Feb 25, 2003·17 cites·10 claims
- 3072US9182622B2Thermal carrier for an LCOS display panel and associated methodsOMNIVISION TECH INC·Filed 2013·Granted Nov 10, 2015·1 cites·11 claims
- 3172US6653574B2Multi-layered substrate with a built-in capacitor design and a method of making the sameSILICON INTEGRATED SYS CORP·Filed 2001·Granted Nov 25, 2003·17 cites·3 claims
- 3272US6509646B1Apparatus for reducing an electrical noise inside a ball grid array packageSILICON INTEGRATED SYS CORP·Filed 2000·Granted Jan 21, 2003·18 cites·7 claims
- 3371US12062673B2Apparatus and method for curved-surface image sensorOMNIVISION TECH INC·Filed 2021·Granted Aug 13, 2024·0 cites·8 claims
- 3470US11211414B2Image sensor packageOMNIVISION TECH INC·Filed 2019·Granted Dec 28, 2021·0 cites·10 claims
- 3569US11626434B2Image sensor packageOMNIVISION TECH INC·Filed 2021·Granted Apr 11, 2023·0 cites·10 claims
- 3669US8665364B2Reinforcement structure for wafer-level camera moduleLIN WEI-FENG·Filed 2011·Granted Mar 4, 2014·3 cites·15 claims
- 3764USD1017438SRing for pulse wave trackingHANGZHOU MEGASENS TECH CO LTD·Filed 2022·Granted Mar 12, 2024·3 cites·1 claims
- 3864US11075239B2Anti-reflective coating with high refractive index material at air interfaceOMNIVISION TECH INC·Filed 2020·Granted Jul 27, 2021·0 cites·20 claims
- 3963US6790758B2Method for fabricating conductive bumps and substrate with metal bumps for flip chip packagingSILICON INTEGRATED SYS CORP·Filed 2002·Granted Sep 14, 2004·12 cites·11 claims
- 4062US12251081B2Endoscope tip assembly using truncated trapezoid cavity interposer to allow coplanar camera and LEDs in small-diameter endoscopesOMNIVISION TECH INC·Filed 2022·Granted Mar 18, 2025·0 cites·16 claims
- 4160US11943525B2Electronic camera module with integral LED and light-pipe illuminatorOMNIVISION TECH INC·Filed 2022·Granted Mar 26, 2024·0 cites·17 claims
- 4260US11404844B2Semiconductor structure and method of manufacturing the sameOMNIVISION TECH INC·Filed 2019·Granted Aug 2, 2022·0 cites·20 claims
- 4360US9568789B2Panel carrier for a liquid crystal on silicon panel and method for electrically interconnecting sameOMNIVISION TECH INC·Filed 2014·Granted Feb 14, 2017·0 cites·18 claims
- 4460US6933600B2Substrate for semiconductor packageSILICON INTEGRATED SYS CORP·Filed 2002·Granted Aug 23, 2005·10 cites·5 claims
- 4559US6365970B1Bond pad structure and its method of fabricatingSILICON INTEGRATED SYS CORP·Filed 1999·Granted Apr 2, 2002·21 cites·18 claims
- 4658US11515347B2Dam of image sensor module having sawtooth pattern and inclined surface on its inner wall and method of making sameLIN WEI FENG·Filed 2020·Granted Nov 29, 2022·0 cites·9 claims
- 4758US6765301B2Integrated circuit bonding device and manufacturing method thereofSILICON INTEGRATED SYS CORP·Filed 2002·Granted Jul 20, 2004·9 cites·4 claims
- 4858US6753595B1Substrates for semiconductor devices with shielding for NC contactsSILICON INTEGRATED SYS CORP·Filed 2003·Granted Jun 22, 2004·9 cites·13 claims
- 4958US2024387588A1Image sensor packages and method thereofOMNIVISION TECH INC·Filed 2023·Application pending·0 cites
- 5057US11520197B2Active-pixel device assemblies with rough coating for stray-light reduction, and methods for manufactureOMNIVISION TECH INC·Filed 2020·Granted Dec 6, 2022·0 cites·8 claims
Showing the top 50 of 90 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →