Inventor · disambiguated record
Wenjian Lin
Also filed as: LIN WENJIAN
0 granted patents·12 pending applications·0 citations·filing 2022–2025
Technology areasH10W
Top patents by PatentIndex Score
12 records- 0171US2025329629A1Packaging structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2025·Application pending·0 cites
- 0261US2023282565A1Packaging structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 0354US2024222143A1Embedded and packaged heat dissipation structure and manufacturing method therefor, and semiconductorZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 0454US2024266244A1Embedded and packaged heat dissipation structure and manufacturing method therefor, and semiconductorZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 0553US2024222245A1Method for manufacturing embedded device packaging substrate, packaging substrate, and semiconductorZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 0653US2024194578A1Embedded device package substrate and manufacturing method thereforZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 0751US2023276576A1Package substrate and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 0851US2024047227A1Package substrate with embedded device, and manufacturing method thereforZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 0950US2023232545A1Method for manufacturing a packaging substrate, and packaging substrateZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 1050US2024153819A1Substrate manufacturing method, embedded substrate and semiconductorZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 1150US2024178088A1Package substrate and manufacturing method thereforZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 1250US2024379504A1Side-exposed embedded trace substrate and manufacturing method thereofZHUHAI YUEXIN SEMICONDUCTOR LLC·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →