Inventor · disambiguated record
Wei-Ting Lin
Also filed as: LIN WEI · LIN WEI T · LIN WEI-TING
95 granted patents·28 pending applications·377 citations·filing 1994–2025
99Inventor score
Top patents by PatentIndex Score
123 records- 0196US11247421B1Single-step extrusion of fiber optic plates for electronic devicesAPPLE INC·Filed 2020·Granted Feb 15, 2022·7 cites·15 claims
- 0296US9832868B1Electronic device display viasAPPLE INC·Filed 2016·Granted Nov 28, 2017·27 cites·20 claims
- 0395US9735043B2Semiconductor packaging structure and processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 15, 2017·16 cites·20 claims
- 0494US9553062B1Fingerprint identification deviceJ-METRICS TECH CO LTD·Filed 2016·Granted Jan 24, 2017·18 cites·17 claims
- 0593US10782818B2Load cell array for detection of force input to an electronic device enclosureAPPLE INC·Filed 2018·Granted Sep 22, 2020·12 cites·16 claims
- 0693US5594609AThermoelectric couple deviceFiled 1994·Granted Jan 14, 1997·82 cites·7 claims
- 0792US11215752B1Electronic devices with image transport layersAPPLE INC·Filed 2020·Granted Jan 4, 2022·7 cites·21 claims
- 0892US9673119B2System and method for bonding package lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 6, 2017·10 cites·20 claims
- 0991US8288208B1Apparatus and methods for semiconductor packages with improved warpageLIU YU-CHIH·Filed 2011·Granted Oct 16, 2012·17 cites·15 claims
- 1091US2025364272A1Semiconductor device and manufacturing method thereofPARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2025·Application pending·0 cites
- 1190US11402869B1Electronic devices having displays with enhanced optical uniformityAPPLE INC·Filed 2020·Granted Aug 2, 2022·3 cites·21 claims
- 1290US10043761B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 7, 2018·5 cites·20 claims
- 1390US8916419B2Lid attach process and apparatus for fabrication of semiconductor packagesCHEN CHIN-LIANG·Filed 2012·Granted Dec 23, 2014·11 cites·20 claims
- 1488US11552054B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 10, 2023·2 cites·20 claims
- 1588US9786520B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 10, 2017·5 cites·20 claims
- 1688US8904326B2Semiconductor device design method, system and computer program productHUANG MU-JEN·Filed 2012·Granted Dec 2, 2014·12 cites·20 claims
- 1786US11417643B2Package-on-package with redistribution structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 16, 2022·3 cites·20 claims
- 1883US10061965B2Fingerprint sensing unit and fingerprint sensing moduleJ METRICS TECH CO LTD·Filed 2016·Granted Aug 28, 2018·5 cites·14 claims
- 1983US9887144B2Ring structure for chip packagingLIN WEN YI·Filed 2011·Granted Feb 6, 2018·7 cites·20 claims
- 2083US9501593B2Semiconductor device design method, system and computer program productTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 22, 2016·3 cites·20 claims
- 2183US9287233B2Adhesive pattern for advance package reliability improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 15, 2016·6 cites·19 claims
- 2282US8652939B2Method and apparatus for die assemblySUNG MING-CHUNG·Filed 2011·Granted Feb 18, 2014·6 cites·14 claims
- 2382US8609460B2Semiconductor structure and fabricating method thereofLIU PO-TSUN·Filed 2011·Granted Dec 17, 2013·8 cites·8 claims
- 2482US2024379382A1Manufacturing method of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2581US12332430B2Seals for optical componentsAPPLE INC·Filed 2023·Granted Jun 17, 2025·0 cites·16 claims
- 2681US9142719B2Patterned substrate and light-emitting diode having the sameWUU DONG-SING·Filed 2011·Granted Sep 22, 2015·5 cites·7 claims
- 2781US8368068B2Display with photo sensor and manufacturing method thereofAU OPTRONICS CORP·Filed 2011·Granted Feb 5, 2013·6 cites·25 claims
- 2880US12157289B2Seals for optical componentsAPPLE INC·Filed 2023·Granted Dec 3, 2024·0 cites·30 claims
- 2980US10157772B2Semiconductor packaging structure and processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·2 cites·20 claims
- 3080US8643006B2Thin film transistor having a patterned passivation layerCHEN CHIA-HSIANG·Filed 2011·Granted Feb 4, 2014·6 cites·9 claims
- 3178US10118193B1Light curing apparatusROLENCE ENTPR INC·Filed 2017·Granted Nov 6, 2018·3 cites·11 claims
- 3277US10510681B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·20 claims
- 3375US10845925B2Electronic device having force sensor air flow promotion structuresAPPLE INC·Filed 2018·Granted Nov 24, 2020·2 cites·29 claims
- 3475US9793242B2Packages with die stack including exposed molding underfillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 17, 2017·3 cites·20 claims
- 3574US9684811B2Suspended capacitive fingerprint sensor and method for manufacturing the sameJ-METRICS TECH CO LTD·Filed 2016·Granted Jun 20, 2017·2 cites·8 claims
- 3673USD1007167SAdjustable foot restLIN WEI·Filed 2022·Granted Dec 12, 2023·4 cites·1 claims
- 3773US9893043B2Method of manufacturing a chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 13, 2018·3 cites·20 claims
- 3872US11031496B2MOSFET and manufacturing method thereofMOSEL VITELIC INC·Filed 2019·Granted Jun 8, 2021·1 cites·10 claims
- 3972US10900518B2Linear guide apparatusLIN WEI TING·Filed 2019·Granted Jan 26, 2021·1 cites·5 claims
- 4071US12046480B2Manufacturing method of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 23, 2024·0 cites·20 claims
- 4171US11972956B2Lid attach process and dispenser headTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 30, 2024·0 cites·24 claims
- 4271US10249291B2Animation synthesis system and lip animation synthesis methodASUSTEK COMP INC·Filed 2017·Granted Apr 2, 2019·2 cites·8 claims
- 4370USD950969SFoot restLIN WEI·Filed 2019·Granted May 10, 2022·11 cites·1 claims
- 4470US9209046B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 8, 2015·2 cites·15 claims
- 4569US10727082B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 28, 2020·1 cites·20 claims
- 4669US9391235B2Patterned substrate for epitaxially growing semiconductor material, and method for patterning a substrateWUU DONG-SING·Filed 2011·Granted Jul 12, 2016·2 cites·4 claims
- 4769US9142523B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 22, 2015·2 cites·20 claims
- 4868US9805997B2Packaging methods for semiconductor devices with encapsulant ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 31, 2017·2 cites·19 claims
- 4967US12464667B2Display cover glassG TECH OPTOELECTRONICS CORP·Filed 2022·Granted Nov 4, 2025·0 cites·8 claims
- 5067US11211339B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·0 cites·20 claims
Showing the top 50 of 123 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →