Inventor · disambiguated record
Wen-Kuei Liu
Also filed as: LIU WEN-KUEI
28 granted patents·8 pending applications·64 citations·filing 2004–2025
95Inventor score
Top patents by PatentIndex Score
36 records- 0191US9236446B2Barc-assisted process for planar recessing or removing of variable-height layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 12, 2016·10 cites·20 claims
- 0289US10734240B2Method and equipment for performing CMP processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 4, 2020·4 cites·20 claims
- 0388US9281192B2CMP-friendly coatings for planar recessing or removing of variable-height layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 8, 2016·7 cites·20 claims
- 0485US2023256563A1Slurry recycling for chemical mechanical planarization systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0584US2025323070A1Wafer taping apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0683US11642754B2Slurry recycling for chemical mechanical polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 9, 2023·1 cites·20 claims
- 0782US11069570B2Method for forming an interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 20, 2021·2 cites·20 claims
- 0882US2022355441A1Slurry recycling for chemical mechanical polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 0976US12368063B2Wafer taping apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 1075US9287127B2Wafer back-side polishing system and method for integrated circuit device manufacturing processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 15, 2016·2 cites·20 claims
- 1173US9852899B2Wafer back-side polishing system and method for integrated circuit device manufacturing processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 26, 2017·1 cites·20 claims
- 1271US11312882B2CMP slurry solution for hardened fluid materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 26, 2022·0 cites·20 claims
- 1371US9559021B2Wafer back-side polishing system and method for integrated circuit device manufacturing processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 31, 2017·1 cites·20 claims
- 1470US11901226B2Method for forming an interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 1570US9748109B2CMP-friendly coatings for planar recessing or removing of variable-height layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 29, 2017·1 cites·20 claims
- 1667US7383708B2Multistage lock cylinder assemblyLIU WEN-KUEI·Filed 2006·Granted Jun 10, 2008·6 cites·16 claims
- 1766US10854468B2Method and equipment for performing CMP processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 1, 2020·0 cites·20 claims
- 1865US2022157618A1Slurry recycling for chemical mechanical polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1964US7975517B2Multistage lock apparatusLIU WEN-KUEI·Filed 2009·Granted Jul 12, 2011·4 cites·8 claims
- 2062US11430677B2Wafer taping apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 30, 2022·0 cites·20 claims
- 2161US11244834B2Slurry recycling for chemical mechanical polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 8, 2022·0 cites·20 claims
- 2261US8840297B2Back-light moduleLIU WEN-KUEI·Filed 2012·Granted Sep 23, 2014·1 cites·11 claims
- 2359US8047032B1Combination lock with two dial platesLIU CHAO-HSUAN·Filed 2010·Granted Nov 1, 2011·4 cites·7 claims
- 2457US11011385B2CMP-friendly coatings for planar recessing or removing of variable-height layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 18, 2021·0 cites·20 claims
- 2557US10774241B2CMP slurry solution for hardened fluid materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 15, 2020·0 cites·20 claims
- 2657USD704527SSteering wheel lockNAN KAI LOCK CO·Filed 2013·Granted May 13, 2014·11 cites·1 claims
- 2754US11872471B2Braking mechanism of a wheeled deviceLIU WEN KUEI·Filed 2022·Granted Jan 16, 2024·0 cites·9 claims
- 2854US9567493B2CMP slurry solution for hardened fluid materialLIN KUO-YIN·Filed 2014·Granted Feb 14, 2017·0 cites·19 claims
- 2953US9478431B2BARC-assisted process for planar recessing or removing of variable-height layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 25, 2016·0 cites·20 claims
- 3048US8882296B2Light emitting diode module and display device using the same light emitting diode moduleCHEN SHENG-WEN·Filed 2012·Granted Nov 11, 2014·3 cites·16 claims
- 3147USD692743SSteering wheel lockLIU WEN-KUEI·Filed 2012·Granted Nov 5, 2013·6 cites·1 claims
- 3243US11305839B2Transmission device for bicycleLIU WEN KUEI·Filed 2019·Granted Apr 19, 2022·0 cites·9 claims
- 3342US2019360238A1Anti-theft structure of dual-locking lockLIU WEN KUEI·Filed 2018·Application pending·0 cites
- 3441US2005156894A1Computer keyboard with a pointing deviceFiled 2004·Application pending·0 cites
- 3540US2017169281A1Fingerprint recognition system of portable electronic deviceLIU WEN-KUEI·Filed 2016·Application pending·0 cites
- 3637US2019362128A1Knuckle-print identification systemLIU WEN KUEI·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →