Inventor · disambiguated record
Wen-Shun Lo
Also filed as: LO WEN-SHUN
24 granted patents·16 pending applications·67 citations·filing 2002–2025
93Inventor score
Top patents by PatentIndex Score
40 records- 0197US10103285B1Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 16, 2018·27 cites·20 claims
- 0294US11830888B2Image sensor with improved timing resolution and photon detection probabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·2 cites·20 claims
- 0393US10157980B1Semiconductor device having diode devices with different barrier heights and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·7 cites·20 claims
- 0490US10985240B2Semiconductor device having diode devices with different barrier heights and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 20, 2021·2 cites·20 claims
- 0590US10658456B2Semiconductor device having diode devices with different barrier heights and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 19, 2020·4 cites·20 claims
- 0684US12328959B2Image sensor with improved timing resolution and photon detection probabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 10, 2025·0 cites·20 claims
- 0784US2025275270A1Image sensor with improved timing resolution and photon detection probabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0881US2025331177A1Memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0980US10515845B2Semiconductor structure including isolations and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·2 cites·20 claims
- 1074US12419046B2Memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 16, 2025·0 cites·20 claims
- 1172US11018168B2Image sensor with improved timing resolution and photon detection probabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 25, 2021·0 cites·20 claims
- 1272US2024379808A1Schottky diode and method of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1371US12259604B2Silicon-based optical device and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 1471US10665727B2Semiconductor structure and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 26, 2020·1 cites·20 claims
- 1571US6906377B2Flash memory cell and fabrication thereofWINBOND ELECTRONICS CORP·Filed 2003·Granted Jun 14, 2005·18 cites·9 claims
- 1669US12107136B2Schottky diode and method of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 1767US12156403B2Method to improve data retention of non-volatile memory in logic processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 26, 2024·0 cites·20 claims
- 1867US11610907B2Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 21, 2023·0 cites·18 claims
- 1966US2025224629A1Silicon-based optical device and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2063US10964586B2Semiconductor structure including isolationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·0 cites·20 claims
- 2163US7585754B2Method of forming bonding pad openingWINBOND ELECTRONICS CORP·Filed 2008·Granted Sep 8, 2009·4 cites·20 claims
- 2262US12259605B2Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 25, 2025·0 cites·20 claims
- 2360US10763329B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 1, 2020·0 cites·20 claims
- 2460US2025306311A1Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2559US2025314821A1Photonic structure and methods of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2659US2025383503A1Photonic integrated circuit and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2758US2025324810A1Tapered light absorption structure for integrated circuit photodetectorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2856US10340343B2Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 2, 2019·0 cites·19 claims
- 2954US2024113091A1Package with semiconductor structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3054US2025048781A1Semiconductor photonics device and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3154US2025370309A1Semiconductor photonics device and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3252US2025237925A1Semiconductor photonics devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3351US2024377659A1Optical modulator and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3450US2024402521A1Semiconductor photonics device and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3546US10162931B2Method of forming serpentine resistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·17 claims
- 3639US8211805B2Method for forming viaLO WEN-SHUN·Filed 2009·Granted Jul 3, 2012·0 cites·19 claims
- 3736US7648910B2Method of manufacturing opening and via openingWINBOND ELECTRONICS CORP·Filed 2007·Granted Jan 19, 2010·0 cites·16 claims
- 3836US2008160768A1Method of manufacturing gate dielectric layerWINBOND ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 3935US10692788B2Device to decrease flicker noise in conductor-insulator-semiconductor (CIS) devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 23, 2020·0 cites·20 claims
- 4035US2004029389A1Method of forming shallow trench isolation structure with self-aligned floating gateWINBOND ELECTRONICS CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →