Inventor · disambiguated record
Wei Keat Loh
Also filed as: LOH WEI KEAT
4 granted patents·2 pending applications·44 citations·filing 2004–2018
73Inventor score
Top patents by PatentIndex Score
6 records- 0176US7179683B2Substrate grooves to reduce underfill fillet bridgingINTEL CORP·Filed 2004·Granted Feb 20, 2007·36 cites·27 claims
- 0271US7291548B2Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making sameINTEL CORP·Filed 2007·Granted Nov 6, 2007·5 cites·20 claims
- 0347US7253088B2Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making sameINTEL CORP·Filed 2004·Granted Aug 7, 2007·3 cites·12 claims
- 0442US10879219B2Lower IC package structure for coupling with an upper IC package to form a package-on-package (PoP) assembly and PoP assembly including such a lower IC package structureINTEL CORP·Filed 2018·Granted Dec 29, 2020·0 cites·19 claims
- 0535US2009016036A1Conductor reinforcement for circuit boardsWONG SHAW FONG·Filed 2007·Application pending·0 cites
- 0630US2012159118A1Lower IC Package Structure for Coupling with an Upper IC Package to Form a Package-On-Package (PoP) Assembly and PoP Assembly Including Such a Lower IC Package StructureWONG SHAW FONG·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →