Inventor · disambiguated record
Wen-Sen Lu
Also filed as: LU WEN-SEN
3 granted patents·1 pending application·76 citations·filing 2014–2023
73Inventor score
Top patents by PatentIndex Score
4 records- 0198US10373885B23D stacked-chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 6, 2019·49 cites·20 claims
- 0296US9666520B23D stacked-chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 30, 2017·26 cites·19 claims
- 0373US10971417B23D stacked-chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 6, 2021·1 cites·19 claims
- 0454US2024412090A1Interconnect chip and l-coupler for modular quantum linksIBM·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →