Inventor · disambiguated record
Wen Wei Lum
Also filed as: LUM WEN WEI
6 granted patents·2 pending applications·11 citations·filing 2018–2025
75Inventor score
Top patents by PatentIndex Score
8 records- 0192US11121074B2Packaged die stacks with stacked capacitors and methods of assembling sameINTEL CORP·Filed 2020·Granted Sep 14, 2021·3 cites·7 claims
- 0287US10593618B2Packaged die stacks with stacked capacitors and methods of assembling sameINTEL CORP·Filed 2018·Granted Mar 17, 2020·3 cites·7 claims
- 0383US10998261B2Over-molded IC package with in-mold capacitorINTEL CORP·Filed 2018·Granted May 4, 2021·4 cites·8 claims
- 0474US2025329626A1Microelectronic device packagesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0570US12374612B2Microelectronic device packages and related methods and systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 29, 2025·0 cites·27 claims
- 0666US10541200B2Over-molded IC packages with embedded voltage reference plane and heater spreaderINTEL CORP·Filed 2018·Granted Jan 21, 2020·1 cites·15 claims
- 0761US12500186B2Capacitor having electrodes formed within a substrateMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 16, 2025·0 cites·27 claims
- 0854US2024260281A1Molded memory assemblies for a system in package semiconductor device assemblyMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →