Inventor · disambiguated record
Wei-Jhih Mao
Also filed as: MAO WEI-JHIH
10 granted patents·3 pending applications·0 citations·filing 2019–2024
78Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD13
Top patents by PatentIndex Score
13 records- 0183US12412863B2Die attached leveling control by metal stopper bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·20 claims
- 0281US12358783B2Wire-bond damper for shock absorptionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 0380US2024270565A1Composite spring structure to reinforce mechanical robustness of a mems deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0479US2024375939A1Stopper bump structures for mems deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0578US12322722B2Die attached leveling control by metal stopper bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 0678US11993510B2Composite spring structure to reinforce mechanical robustness of a MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 0773US12497285B2Stopper bump structures for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·20 claims
- 0871US11987494B2Wire-bond damper for shock absorptionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·0 cites·20 claims
- 0970US11420866B2Composite spring structure to reinforce mechanical robustness of a MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 23, 2022·0 cites·20 claims
- 1069US11923331B2Die attached leveling control by metal stopper bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 1157US11661333B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 30, 2023·0 cites·20 claims
- 1256US2025271614A1Waveguide with transitional portion and method of fabricating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1351US11235969B2CMOS-MEMS integration with through-chip via processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 1, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →