Inventor · disambiguated record
Wei Li Julien Mok
Also filed as: MOK WEI LI JULIEN
0 granted patents·3 pending applications·0 citations·filing 2023–2024
Technology areasH10W
Files withTEXAS INSTRUMENTS INC3
Top patents by PatentIndex Score
3 records- 0155US2025309063A1Shaped die for semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0250US2024339382A1Molded package with an interchangeable leadframeTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0350US2024347425A1Integrated circuit package with multiple interconnectsTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →