Inventor · disambiguated record
Weng Khoon Mong
Also filed as: MONG WENG KHOON
8 granted patents·3 pending applications·103 citations·filing 2002–2024
84Inventor score
Top patents by PatentIndex Score
11 records- 0186US6713366B2Method of thinning a wafer utilizing a laminated reinforcing layer over the device sideINTEL CORP·Filed 2002·Granted Mar 30, 2004·58 cites·27 claims
- 0283US7005317B2Controlled fracture substrate singulationINTEL CORP·Filed 2003·Granted Feb 28, 2006·33 cites·24 claims
- 0382US7172951B2Apparatus for controlled fracture substrate singulationINTEL CORP·Filed 2005·Granted Feb 6, 2007·10 cites·16 claims
- 0455US8258019B2Flip chip assembly process for ultra thin substrate and package on package assemblyMONG WENG KHOON·Filed 2008·Granted Sep 4, 2012·2 cites·9 claims
- 0555US2024407100A1Electrolytic capacitors having enclosures that enable the capacitors to be surface mounted to a substrateWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 0655US2025357425A1Semiconductor package including a semiconductor die matrix tileSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0751US9397016B2Flip chip assembly process for ultra thin substrate and package on package assemblyINTEL CORP·Filed 2014·Granted Jul 19, 2016·0 cites·18 claims
- 0850US2024413032A1Insulation layer for a semiconductor packageWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 0942US8847368B2Flip chip assembly process for ultra thin substrate and package on package assemblyMONG WENG KHOON·Filed 2012·Granted Sep 30, 2014·0 cites·16 claims
- 1037US10798814B2SiP module and manufacturing method of the SiP moduleUNIVERSAL SCIENT INDUSTRIAL SHANGHAI CO LTD·Filed 2018·Granted Oct 6, 2020·0 cites·6 claims
- 1134US11817360B2Chip scale package semiconductor device and method of manufactureNexperia BV·Filed 2018·Granted Nov 14, 2023·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →