Inventor · disambiguated record
Wei-Chun Pai
Also filed as: PAI WEI-CHUN
1 granted patent·2 pending applications·0 citations·filing 2022–2025
13Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3
Top patents by PatentIndex Score
3 records- 0169US2025349784A1Integrated Circuit Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0265US2025309159A1Shifting contact pad for reducing stressTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0359US12394735B2Shifting contact pad for reducing stressTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →