Inventor · disambiguated record
Wei Sheng
Also filed as: SHENG WEI · SHENG WEI-KONG
7 granted patents·13 pending applications·4 citations·filing 2014–2025
71Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD7ADVANCED MICRO DEVICES INC3ASIA VITAL COMPONENTS CO LTD3BEIJING WEHAND BIO PHARMACEUTICAL CO LTD1HYGON INFORMATION TECHNOLOGY CO LTD1
Top patents by PatentIndex Score
20 records- 0176US2025364362A1Hybrid Vapor Chamber LidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0275US11131508B2Middle member of heat dissipation device and the heat dissipation deviceASIA VITAL COMPONENTS CO LTD·Filed 2018·Granted Sep 28, 2021·3 cites·38 claims
- 0370US11325669B1Bicycle adjustable seatpostTIEN HSIN INDUSTRIES CO LTD·Filed 2020·Granted May 10, 2022·1 cites·12 claims
- 0470US2025246513A1Hybrid Vapor Chamber LidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0560US2025357262A1Package assembly and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0659US2025349666A1Semiconductor package with heat spreading lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0759US2025343104A1Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0854US2024162109A1Package with Improved Heat Dissipation Efficiency and Method for Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0953US2025390437A1Scalable input/output memory management unit (iommu) command processingADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 1051US2025190351A1Address translation preloadingADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 1150US12345695B2Preparation method and application of flexible paper-based sensor for detecting meat productsUNIV JIANGSU·Filed 2025·Granted Jul 1, 2025·0 cites·7 claims
- 1250US2025144030A1Osmotic pump controlled-release tablet of insoluble drug and preparation method thereforBEIJING WEHAND BIO PHARMACEUTICAL CO LTD·Filed 2022·Application pending·0 cites
- 1350US2025251667A1Interposer and method of forming the sameHYGON INFORMATION TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 1448US2024128149A1Cooling interface region for a semiconductor die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1547US11219940B2Manufacturing method of middle member structureASIA VITAL COMPONENTS CO LTD·Filed 2019·Granted Jan 11, 2022·0 cites·8 claims
- 1647US2024296128A1Efficient input/output memory management unitADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 1743US10397093B2Method for acquiring cross-domain separation paths, path computation element and related storage mediumZTE CORP·Filed 2014·Granted Aug 27, 2019·0 cites·9 claims
- 1843US2019285357A1Middle member of heat dissipation device and the heat dissipation deviceASIA VITAL COMPONENTS CO LTD·Filed 2018·Application pending·0 cites
- 1940US12247126B2Near-infrared harvesting transparent luminescent solar concentrators with engineered stokes shiftUNIV MICHIGAN STATE·Filed 2019·Granted Mar 11, 2025·0 cites·18 claims
- 2030US11014846B2Scaling resistant ceramic glaze and functional overglaze for Q345 hot rolled alloy steel double sided enamelingJIANGXI KOSEN ENTECH CO LTD·Filed 2019·Granted May 25, 2021·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →