Inventor · disambiguated record
Wei Si
Also filed as: SI WEI · SI WEI-TAO
2 granted patents·9 pending applications·5 citations·filing 2009–2025
42Inventor score
Files withZTE CORP4SAE MAGNETICS HK LTD2EVE ENERGY STORAGE CO LTD1FULIAN YUZHAN PRECISION TECH CO LTD1SAMSUNG ELECTRONICS CO LTD1
Top patents by PatentIndex Score
11 records- 0179US11016634B2Refrigerator storage system having a displaySAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 25, 2021·5 cites·26 claims
- 0265US2025383273A1Devices for testing volume deformations of mass concreteTIANJIN PORT ENGINEERING INST CO LTD OF CCCC FIRST HARBOR ENGINEERING CO LTD·Filed 2025·Application pending·0 cites
- 0360US2023384769A1Method for establishing dyeing model, dyeing method, and dyeing deviceFULIAN YUZHAN PRECISION TECH CO LTD·Filed 2023·Application pending·0 cites
- 0459US2025319337A1Method and apparatus for determining protection strategy for energy storage system, and device related theretoEVE ENERGY STORAGE CO LTD·Filed 2025·Application pending·0 cites
- 0554US2025267763A1Resource management method, and electronic device and computer-readable storage mediumZTE CORP·Filed 2023·Application pending·0 cites
- 0653US2025031261A1Adaptation method for ne-dc architecture, and operation control apparatus, base station apparatus and storage mediumZTE CORP·Filed 2022·Application pending·0 cites
- 0750US2024356710A1Data transmission method and apparatus, and storage medium and program productZTE CORP·Filed 2022·Application pending·0 cites
- 0847US12225612B2Dual connection re-establishment method, readable storage medium, and base stationZTE CORP·Filed 2020·Granted Feb 11, 2025·0 cites·12 claims
- 0940US2010200147A1Adhesive bonding methodSAE MAGNETICS HK LTD·Filed 2009·Application pending·0 cites
- 1034US2011198014A1Adhesive bonding methodSAE MAGNETICS HK LTD·Filed 2011·Application pending·0 cites
- 1127US2012120915A1Method, Apparatus and System for Implementing X2 HandoverWANG DAFEI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →