Inventor · disambiguated record
Wen-Bin Sun
Also filed as: SUN WEN-BIN
6 granted patents·4 pending applications·48 citations·filing 2004–2014
82Inventor score
Top patents by PatentIndex Score
10 records- 0189US7279782B2FBGA and COB package structure for image sensorADVANCED CHIP ENG TECH INC·Filed 2005·Granted Oct 9, 2007·21 cites·25 claims
- 0267US9405323B2Wearable electronic deviceSHENZHEN FUTAIHONG PREC IND CO·Filed 2014·Granted Aug 2, 2016·2 cites·16 claims
- 0366US7476565B2Method for forming filling paste structure of WL packageADVANCED CHIP ENG TECH INC·Filed 2007·Granted Jan 13, 2009·3 cites·16 claims
- 0459US7525139B2Image sensor with a protection layerADVANCED CHIP ENG TECH INC·Filed 2004·Granted Apr 28, 2009·7 cites·8 claims
- 0557US7224061B2Package structureADVANCED CHIP ENG TECH INC·Filed 2004·Granted May 29, 2007·8 cites·14 claims
- 0652US7400037B2Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSPADVANCED CHIP ENGINEERING TACH·Filed 2004·Granted Jul 15, 2008·7 cites·12 claims
- 0752US2008268647A1Method of plasma etching with pattern maskADVANCED CHIP ENG TECH INC·Filed 2008·Application pending·0 cites
- 0850US2015346767A1Wearable electronic deviceSHENZHEN FUTAIHONG PREC IND CO·Filed 2014·Application pending·0 cites
- 0948US2007262051A1Method of plasma etching with pattern maskADVANCED CHIP ENG TECH INC·Filed 2006·Application pending·0 cites
- 1045US2015346778A1Electronic deviceSHENZHEN FUTAIHONG PREC IND CO·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →