Inventor · disambiguated record
Wei-Chang Tai
Also filed as: TAI WEI-CHANG · TAI WEI-JEN
5 granted patents·6 pending applications·119 citations·filing 2003–2006
81Inventor score
Top patents by PatentIndex Score
11 records- 0193US7417329B2System-in-package structureADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Aug 26, 2008·39 cites·17 claims
- 0292US7473629B2Substrate structure having a solder mask and a process for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jan 6, 2009·30 cites·9 claims
- 0382US6815833B2Flip chip packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 9, 2004·33 cites·50 claims
- 0469US7180181B2Mesh shaped dam mounted on a substrateADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Feb 20, 2007·17 cites·19 claims
- 0544US2005181543A1Semiconductor package module and manufacturing method thereofFiled 2005·Application pending·0 cites
- 0641US7195956B2Method for balancing molding flow during the assembly of semiconductor packages with defective carrying unitsADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Mar 27, 2007·0 cites·20 claims
- 0740US2007072341A1Die package and method for making the sameTAI WEI-CHANG·Filed 2006·Application pending·0 cites
- 0839US2006110849A1Method for stacking BGA packages and structure from the sameLEE CHENG-YIN·Filed 2005·Application pending·0 cites
- 0939US2004113266A1[semiconductor package module and manufacturing mehod thereof]Filed 2003·Application pending·0 cites
- 1037US2004080036A1System in package structureADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
- 1131US2005040928A1Voltage-compensated resistive touch panelFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →