Inventor · disambiguated record
Wei Leong Tan
Also filed as: TAN WEI LEONG
1 granted patent·4 pending applications·0 citations·filing 2018–2024
7Inventor score
Files withNexperia BV5
Top patents by PatentIndex Score
5 records- 0154US2025132289A1Method of manufacturing semiconductor assembliesNexperia BV·Filed 2024·Application pending·0 cites
- 0246US2023326835A1Molded electronic package and method for manufacturing the sameNexperia BV·Filed 2023·Application pending·0 cites
- 0345US2023411175A1Method for manufacturing a semiconductor package assembly as well as such semiconductor package assemblyNexperia BV·Filed 2023·Application pending·0 cites
- 0438US2023402355A1Electronic package with heatsink and manufacturing method thereforNexperia BV·Filed 2023·Application pending·0 cites
- 0535US11728179B2Surface mount semiconductor device and method of manufactureNexperia BV·Filed 2018·Granted Aug 15, 2023·0 cites·13 claims
Join the waitlist — get patent alerts
Get an alert when Wei Leong Tan files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →