Inventor · disambiguated record
Wei Tan
Also filed as: TAN WEI · TAN WEI JERN
4 granted patents·7 pending applications·8 citations·filing 2011–2023
61Inventor score
Top patents by PatentIndex Score
11 records- 0178US9960105B2Controlled solder height packages and assembly processesINTEL CORP·Filed 2012·Granted May 1, 2018·8 cites·13 claims
- 0255US2025107003A1Methods and apparatus to manage noise for timing circuitryINTEL CORP·Filed 2023·Application pending·0 cites
- 0349US2018236609A1Hybrid low metal loading fluxINTEL CORP·Filed 2018·Application pending·0 cites
- 0445US9950393B2Hybrid low metal loading fluxSIDHU RAJEN S·Filed 2011·Granted Apr 24, 2018·0 cites·25 claims
- 0542US9283641B2Flux materials for heated solder placement and associated techniques and configurationsINTEL CORP·Filed 2012·Granted Mar 15, 2016·0 cites·26 claims
- 0640US2020187352A1Printed circuit board using two-via geometryINTEL CORP·Filed 2019·Application pending·0 cites
- 0737US11239126B2Rod-based substrate with ringed interconnect layersINTEL CORP·Filed 2017·Granted Feb 1, 2022·0 cites·26 claims
- 0836US2016173055A1Impedance matching in a transmission lineINTEL CORP·Filed 2014·Application pending·0 cites
- 0935US2016181222A1Pickhead for solder ball placement on an integrated circuit packageSOOD MOHIT·Filed 2014·Application pending·0 cites
- 1032US2018324955A1No-flow adhesive for second and third level interconnectsINTEL CORP·Filed 2015·Application pending·0 cites
- 1131US2017066088A1Ball grid array (bga) apparatus and methodsINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →