Inventor · disambiguated record
Wei Tan
Also filed as: TAN WEI · TAN WEI KIONG
3 granted patents·3 pending applications·0 citations·filing 2012–2024
44Inventor score
Top patents by PatentIndex Score
6 records- 0173US12176318B2Thermal compression bonder nozzle with vacuum relief featuresINTEL CORP·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 0266US11652080B2Thermal compression bonder nozzle with vacuum relief featuresINTEL CORP·Filed 2021·Granted May 16, 2023·0 cites·13 claims
- 0359US2025391807A1Dynamic substrate thermal displacement compensationINTEL CORP·Filed 2024·Application pending·0 cites
- 0439US2024187758A1Zero Thermal Gradient Camera Core And Method For Making The SameT SMART PTE LTD·Filed 2021·Application pending·0 cites
- 0538US2023140390A1Structure and Method of Manufacturing for a Hermetic Housing Enclosure for a Thermal Shock Proof, Zero Thermal Gradient Imaging or Sensing CoreT SMART SYSTEMS LLC·Filed 2021·Application pending·0 cites
- 0637US8895365B2Techniques and configurations for surface treatment of an integrated circuit substrateRAMALINGAM SURIYAKALA·Filed 2012·Granted Nov 25, 2014·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →