Inventor · disambiguated record
Weihua Tang
Also filed as: TANG WEIHUA
20 granted patents·8 pending applications·39 citations·filing 2009–2025
91Inventor score
Top patents by PatentIndex Score
28 records- 0188US11374605B1Self-diagnosis system for wireless transceivers with multiple antennasNXP USA INC·Filed 2021·Granted Jun 28, 2022·2 cites·20 claims
- 0286US11756860B2Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2019·Granted Sep 12, 2023·3 cites·25 claims
- 0385US8920934B2Hybrid solder and filled paste in microelectronic packagingJIANG HONGJIN·Filed 2013·Granted Dec 30, 2014·17 cites·16 claims
- 0484US12341080B2Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
- 0584US11948906B2Hybrid backside thermal structures for enhanced IC packagesINTEL CORP·Filed 2020·Granted Apr 2, 2024·2 cites·25 claims
- 0684US2025293117A1Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2025·Application pending·0 cites
- 0781US11676883B2Thermoelectric coolers combined with phase-change material in integrated circuit packagesINTEL CORP·Filed 2019·Granted Jun 13, 2023·2 cites·23 claims
- 0880US11574851B2Coupled cooling fins in ultra-small systemsINTEL CORP·Filed 2019·Granted Feb 7, 2023·3 cites·23 claims
- 0979US11978689B2Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 1074US12482779B2Hybrid backside thermal structures for enhanced ic packagesINTEL CORP·Filed 2024·Granted Nov 25, 2025·0 cites·20 claims
- 1168US11626395B2Thermal spreading management of 3D stacked integrated circuitsINTEL CORP·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 1268US9608844B2System and method for performing channel estimation on an OFDM signalNXP BV·Filed 2014·Granted Mar 28, 2017·2 cites·19 claims
- 1365US11444003B2Integrated heat spreader with multiple channels for multichip packagesINTEL CORP·Filed 2018·Granted Sep 13, 2022·1 cites·20 claims
- 1459US8566683B2Power-reduced preliminary decoded bits in viterbi decodersHEKSTRA ANDRIES PIETER·Filed 2009·Granted Oct 22, 2013·4 cites·28 claims
- 1557US11127727B2Thermal spreading management of 3D stacked integrated circuitsINTEL CORP·Filed 2019·Granted Sep 21, 2021·0 cites·18 claims
- 1654US12021016B2Thermally enhanced silicon back end layers for improved thermal performanceINTEL CORP·Filed 2020·Granted Jun 25, 2024·0 cites·16 claims
- 1752US2025301596A1Hotspot Mitigation In Computing Equipment Using Enhanced Air MixingGOOGLE LLC·Filed 2024·Application pending·0 cites
- 1851US11398414B2Sloped metal features for cooling hotspots in stacked-die packagesINTEL CORP·Filed 2018·Granted Jul 26, 2022·0 cites·11 claims
- 1951US8904266B2Multi-standard viterbi processorTANG WEIHUA·Filed 2010·Granted Dec 2, 2014·3 cites·14 claims
- 2049US2022384306A1Thermal interface structure for integrated circuit device assembliesINTEL CORP·Filed 2021·Application pending·0 cites
- 2148US11756856B2Package architecture including thermoelectric cooler structuresINTEL CORP·Filed 2018·Granted Sep 12, 2023·0 cites·14 claims
- 2244US2020111720A1Dual side die packaging for enhanced heat dissipationINTEL CORP·Filed 2018·Application pending·0 cites
- 2343US9071492B2Reduced latency channel-estimationNXP BV·Filed 2013·Granted Jun 30, 2015·0 cites·14 claims
- 2440US11664294B2Phase change materials for electromagnetic interference shielding and heat dissipation in integrated circuit assembliesINTEL CORP·Filed 2019·Granted May 30, 2023·0 cites·18 claims
- 2538US2020219789A1Thermal management solutions for integrated circuit assemblies using phase change materialsINTEL CORP·Filed 2019·Application pending·0 cites
- 2636US2015060527A1Non-uniform heater for reduced temperature gradient during thermal compression bondingTANG WEIHUA·Filed 2013·Application pending·0 cites
- 2735US2015001736A1Die connections using different underfill types for different regionsSHI HUALIANG·Filed 2013·Application pending·0 cites
- 2834US2016377658A1Fluid flow in a temperature control actuator for semiconductor device testINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →