Inventor · disambiguated record
Wee Boon Tay
Also filed as: TAY WEE BOON
6 granted patents·4 pending applications·5 citations·filing 2016–2022
69Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0175US9728492B1Strip testing of semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 8, 2017·4 cites·21 claims
- 0256US9640459B1Semiconductor device including a solder barrierINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 2, 2017·1 cites·20 claims
- 0353US2023095545A1Semiconductor Packages and Methods for Manufacturing ThereofINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 0444US11183451B2Interconnect clip with angled contact surface and raised bridgeINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 23, 2021·0 cites·20 claims
- 0542US11239127B2Topside-cooled semiconductor package with molded standoffINFINEON TECHNOLOGIES AG·Filed 2020·Granted Feb 1, 2022·0 cites·20 claims
- 0640US10978378B2Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrierINFINEON TECHNOLOGIES AG·Filed 2018·Granted Apr 13, 2021·0 cites·13 claims
- 0740US2021313294A1Semiconductor package and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 0840US2022173020A1An electrical connection structure and an electronic device including the sameINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 0931US10037934B2Semiconductor chip package having contact pins at short side edgesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Jul 31, 2018·0 cites·17 claims
- 1031US2021074667A1Interconnect Clip with Angled Contact Surface and Raised Bridge Technical FieldINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Wee Boon Tay files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →