Inventor · disambiguated record

Wei-Jhan Tsai

Also filed as: TSAI WEI-JHAN

3 granted patents·2 pending applications·0 citations·filing 2022–2025

41Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD5

Top patents by PatentIndex Score

5 records

0170US2025285953A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0263US12334424B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
0355US12512384B2Semiconductor package with electrically conductive structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
0455US2025079283A1Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
0553US12354929B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →