Inventor · disambiguated record
Wen-Li Tsai
Also filed as: TSAI WEN LI
6 granted patents·10 pending applications·27 citations·filing 2006–2013
79Inventor score
Files withPROMOS TECHNOLOGIES INC12CHIEN CHUN-HSIEN1CHUNGHWA PICTURE TUBES LTD1TUNG CHIUN-YEN1WU HSIAO-CHE1
Top patents by PatentIndex Score
16 records- 0181US9125351B2Plant cultivation deviceCHUNGHWA PICTURE TUBES LTD·Filed 2013·Granted Sep 8, 2015·7 cites·11 claims
- 0278US7436526B2Real-time system for monitoring and controlling film uniformity and method of applying the samePROMOS TECHNOLOGIES INC·Filed 2007·Granted Oct 14, 2008·8 cites·20 claims
- 0373US7932565B2Integrated circuit structure having bottle-shaped isolationPROMOS TECHNOLOGIES INC·Filed 2008·Granted Apr 26, 2011·6 cites·18 claims
- 0466US7781830B2Recessed channel transistor and method for preparing the samePROMOS TECHNOLOGIES INC·Filed 2008·Granted Aug 24, 2010·3 cites·11 claims
- 0557US8421179B2Schottky diode with high antistatic capabilityTUNG CHIUN-YEN·Filed 2011·Granted Apr 16, 2013·3 cites·6 claims
- 0645US2009061635A1Method for forming micro-patternsPROMOS TECHNOLOGIES INC·Filed 2008·Application pending·0 cites
- 0745US2009317982A1Atomic layer deposition apparatus and method for preparing metal oxide layerPROMOS TECHNOLOGIES INC·Filed 2008·Application pending·0 cites
- 0844US2009023268A1Isolation method of active area for semiconductor devicePROMOS TECHNOLOGIES INC·Filed 2008·Application pending·0 cites
- 0944US2009039428A1Fabricating method for silicon on insulator and structure thereofPROMOS TECHNOLOGIES INC·Filed 2008·Application pending·0 cites
- 1043US7919384B2Method of making planar-type bottom electrode for semiconductor devicePROMOS TECHNOLOGIES INC·Filed 2008·Granted Apr 5, 2011·0 cites·19 claims
- 1143US2009189246A1Method of forming trench isolation structures and semiconductor device produced therebyWU HSIAO-CHE·Filed 2008·Application pending·0 cites
- 1241US2008102207A1Gas delivering system for in situ thermal treatment and thin film deposition and use of the samePROMOS TECHNOLOGIES INC·Filed 2007·Application pending·0 cites
- 1340US2008316674A1Capacitors and methods for fabricating the samePROMOS TECHNOLOGIES INC·Filed 2007·Application pending·0 cites
- 1439US2008128892A1Intergrated Circuits Device Having a Reinforcement StructurePROMOS TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 1539US2008132053A1Method for Preparing an Intergrated Circuits Device Having a Reinforcement StructurePROMOS TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 1632US2012133046A1Semiconductor structure and process thereofCHIEN CHUN-HSIEN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →