Inventor · disambiguated record
Wen-Chieh Tsou
Also filed as: TSOU WEN-CHIEH
12 granted patents·2 pending applications·38 citations·filing 2008–2024
86Inventor score
Files withSENSORTEK TECH CORP4TSOU WEN-CHIEH4EVERLIGHT ELECTRONICS CO LTD3TAIWAN SEMICONDUCTOR MFG CO LTD2CHEN YUNG-HO1
Top patents by PatentIndex Score
14 records- 0170US10161033B2Method for cleaning load port of wafer processing apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 25, 2018·2 cites·20 claims
- 0266US7772019B2Method for packaging LED deviceEVERLIGHT ELECTRONICS CO LTD·Filed 2008·Granted Aug 10, 2010·3 cites·8 claims
- 0365USD640644SLight emitting diode packageEVERLIGHT ELECTRONICS CO LTD·Filed 2010·Granted Jun 28, 2011·15 cites·1 claims
- 0462US8879023B2Circuit substrate and light emitting diode packageTSOU WEN-CHIEH·Filed 2009·Granted Nov 4, 2014·2 cites·4 claims
- 0562USD628540SLight emitting diodeEVERLIGHT ELECTRONICS CO LTD·Filed 2010·Granted Dec 7, 2010·13 cites·1 claims
- 0660US2025015206A1Light Sensing Device Packaging Structure and Packaging Method thereofSENSORTEK TECH CORP·Filed 2024·Application pending·0 cites
- 0757US8283790B2Electronic deviceTSOU WEN-CHIEH·Filed 2010·Granted Oct 9, 2012·1 cites·20 claims
- 0855US12402431B2Complex sensing device packaging structure and packaging methodSENSORTEK TECH CORP·Filed 2021·Granted Aug 26, 2025·0 cites·1 claims
- 0955US8492283B2Method and structure for automated inert gas charging in a reticle stockerCHEN YUNG-HO·Filed 2008·Granted Jul 23, 2013·2 cites·11 claims
- 1054US9772563B2Method and structure for automated inert gas charging in a reticle stockerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 26, 2017·0 cites·15 claims
- 1151US8928837B2Circuit substrate and light emitting diode packageTSOU WEN-CHIEH·Filed 2011·Granted Jan 6, 2015·0 cites·16 claims
- 1249US11056607B2Complex sensing device packaging structure and packaging methodSENSORTEK TECH CORP·Filed 2019·Granted Jul 6, 2021·0 cites·11 claims
- 1347US2022140172A1Light sensing device packaging structure and packaging method thereofSENSORTEK TECH CORP·Filed 2021·Application pending·0 cites
- 1437US8513820B2Package substrate structure and chip package structure and manufacturing process thereofTSOU WEN-CHIEH·Filed 2010·Granted Aug 20, 2013·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →