Inventor · disambiguated record
Wen-Chieh Tu
Also filed as: TU WEN-CHIEH
1 granted patent·2 pending applications·0 citations·filing 2004–2019
6Inventor score
Technology areasH10W
Files withHIMAX TECH LTD2
Top patents by PatentIndex Score
3 records- 0137US2009091028A1Semiconductor device and method of bump formationHIMAX TECH LTD·Filed 2008·Application pending·0 cites
- 0235US10777525B1Filp chip packageHIMAX TECH LTD·Filed 2019·Granted Sep 15, 2020·0 cites·20 claims
- 0328US2005133912A1Electrical connection structureFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →