Inventor · disambiguated record
Wen-Chiung Tu
Also filed as: TU WEN-CHIUNG
4 granted patents·16 pending applications·0 citations·filing 2021–2025
56Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD20
Top patents by PatentIndex Score
20 records- 0184US2025357392A1Reduction of cracks in passivation layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0278US2025357372A1IC Structure with Stress-Release Pattern to Enhance Package YieldTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0377US2024379593A1Reduction of cracks in passivation layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0477US2025357336A1Semiconductor device with seal ring structure and method making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0575US2025357373A1Passive Device Structure Stress ReductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0674US2024365564A1Structure and method for mram devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0772US2025349627A1Sacrificial test padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0872US2025300065A1High voltage passive device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0972US2024387617A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1071US2025118683A1IC Structure with Stress-Release Pattern to Enhance Package YieldTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1170US12087714B2Reduction of cracks in passivation layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 10, 2024·0 cites·20 claims
- 1269US2025038105A1Semiconductor device with seal ring structure and method making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1368US12327785B2High voltage passive device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 10, 2025·0 cites·20 claims
- 1467US12063790B2Structure and method for MRAM devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 13, 2024·0 cites·20 claims
- 1566US2025132208A1Sacrificial test padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1665US2025185262A1Back-end-of-line passive device structure having common connection to groundTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1764US12218186B2Back-end-of-line passive device structure having common connection to groundTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 1858US2025218940A1Semiconductor structure and method of fabricating a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1954US2024113011A1Semiconductor Structures And Methods Of Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2051US2024145378A1Via with sacrificial stress barrier ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →