Inventor · disambiguated record
Wei-Hsiang Tu
Also filed as: TU WEI-HSIANG
5 granted patents·3 pending applications·3 citations·filing 2020–2025
66Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD8
Top patents by PatentIndex Score
8 records- 0190US11222859B2Semiconductor device structure with bonding pad and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 11, 2022·3 cites·20 claims
- 0283US2025364461A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0383US2025357388A1Methods of forming mimcap corner structures in the keep-out zones of a semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0479US12476211B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 18, 2025·0 cites·20 claims
- 0569US12482766B2MIMcap corner structures in the keep-out zones of a semiconductor die and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·19 claims
- 0668US12021048B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 0762US12009327B2Semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 0855US2025167104A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →